Wafer clamping assembly and method for clamping wafer

Abstract

The invention provides a wafer clamping assembly and a method for clamping a wafer, wherein the wafer clamping assembly comprises a platform having a top surface, a stopper arranged at a front end ofthe platform, a push rod arranged at a rear end of the platform, at least an actuator pivotally connected to the push rod; and a sensor arranged at the front end of the platform for measuring the distance between the sensor and the wafer thereon.

Description

technical field [0001] The present invention relates to a wafer clamp, in particular to a wafer clamp suitable for a robot system for picking up and placing wafers. Background technique [0002] A robotic hand or fork of a robotic system is commonly used to automatically pick up and place wafers (wafers or chips). Conventional robotic systems use vacuum forks to hold the wafer. Because the traditional vacuum fork is prone to misalignment, the wafer cannot be accurately aligned and picked up, causing the wafer to drop and break. [0003] In addition, conventional vacuum forks are designed to contact either the top or bottom surface of the wafer to be picked up. Such devices cannot be applied to some wafers, such as optical components (such as optical lenses or glass). [0004] In view of this, an engaged tooth fork is proposed to improve the lack of vacuum tooth fork. However, the conventional meshing fork cannot move and rotate quickly, thus causing the wafer 10 to bounc...

AI Technical Summary

Problems solved by technology

However, the conventional meshing fork cannot move and rotate quickly, thus causing the wafer 10 to bounce off

[0005] In view of the fact that traditional mechanical forks cannot effectively align and pick up wafers, it is urgent to propose a novel wafer fixture to improve the shortcomings of traditional mechanical forks

Images