Reflow Soldering Unit
A technology of reflow soldering and heating area, which is applied in the direction of auxiliary equipment, welding equipment, printed circuit assembly of electric components, etc. It can solve the problems of poor patterns and difficult heat transfer of heaters, etc., and achieve the effect of inhibiting the liquefaction of flux fume
Active Publication Date: 2022-03-22
TAMURA KK
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Problems solved by technology
Furthermore, it is described that since the heat from the heater is difficult to transfer, dew condensation of organic solvent gas occurs near the substrate inlet and outlet, and the dew condensation drops on the substrate, resulting in poor patterns.
Method used
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[0030] Hereinafter, the present invention will be described through embodiments. In addition, description will be performed in the following order.
[0031]
[0032]
[0033]
[0034]
[0035] In addition, one embodiment described below is a preferred specific example of the present invention, and various limitations that are technically preferable are added. However, in the following description, unless there is a description that specifically limits the gist of the present invention, the scope of the present invention is not limited. It is not limited to these embodiments.
[0036]
[0037] figure 1 A schematic configuration of a conventional reflow apparatus to which the present invention can be applied is shown. exist figure 1 In , for convenience of explanation, the illustration of the flux recovery device arranged outside the reflow furnace is omitted. The object to be heated, in which surface mount electronic components are mounted on both sides of the p...
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The present invention is a reflow soldering device capable of preventing flux fume from being liquefied and dripping onto a heated object from being liquefied in a cooling region of the reflow soldering device, thereby preventing the quality of the heated object from deteriorating. The reflow soldering device has: a heating area, which includes a plurality of areas, and the plurality of areas include an area for soldering relative to the heated object; a cooling area, which is arranged behind the heating area and used to cool the soldered heated object; and a conveying part that conveys the object to be heated in the heating zone and the cooling zone, the reflow soldering apparatus is characterized in that it has: a blowing part near the entrance of the inlet side region of the heating region and / or the outlet side region of the heating region The vicinity of the outlet of the outlet has a blowing outlet extending in a direction substantially perpendicular to the conveying direction, and the gas is blown out from the blowing outlet in a direction in which the gas in the heating region is pushed back to the inside; and a suction portion is arranged near the blowing portion, and extend in a direction substantially perpendicular to the conveying direction.
Description
technical field [0001] The present invention relates to a reflow soldering device, in particular to a reflow soldering device capable of preventing liquefied flux from dripping onto heated objects such as printed circuit boards. Background technique [0002] A reflow soldering apparatus is used in which a solder composition is previously supplied to an electronic component or a printed circuit board, and the printed circuit board is conveyed into a reflow furnace by a conveyor. The reflow apparatus has a conveyor for conveying a to-be-heated object, and a reflow furnace main body to which a to-be-heated object is supplied by this conveyor. The reflow furnace is divided into a plurality of areas, for example, along a conveyance path from an input port to an output port, and these areas are arranged in a row. The multiple zones have the role of heating zones, cooling zones, etc. according to their functions. [0003] The solder composition includes, for example, powdered sol...
Claims
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IPC IPC(8): H05K3/34B23K3/08B23K1/008
CPCH05K3/34B23K1/008B23K3/08
Inventor 斋藤彰一田森信章冈野询真田卓摩
Owner TAMURA KK