Heat dissipation structure and communication equipment

A channel and air intake channel technology, which is applied to structural components of electrical equipment, cooling/ventilation/heating renovation, electrical components, etc., can solve the problem of low heat dissipation efficiency of heat dissipation structure, reduce the influence of thermal cascade, and improve heat dissipation efficiency. Effect

Inactive Publication Date: 2018-11-02
ZTE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the embodiments of the present invention is to provide a heat dissipation architecture and communication equipment, which solves the problem of low heat dissipation efficiency of the heat dissipation architecture

Method used

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  • Heat dissipation structure and communication equipment
  • Heat dissipation structure and communication equipment
  • Heat dissipation structure and communication equipment

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Embodiment Construction

[0026] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0027] Such as Figure 1-2 As shown, a heat dissipation framework provided by an embodiment of the present invention includes a housing 10, at least one front board module 11, at least one rear board module 21, a first air exhaust device 40 and a second air exhaust device 50 ,in:

[0028] The front board module 11 and the rear board module 21 are respectively arranged at the front and rear ends of the housing 10;

[0029] The housing 10 is provided with a first air inlet 12 corresponding to the rear board module 21, and the first air inlet 12 communicates with the rear board module 21, and the housing 10 is provided with a second air inlet 14 corresponding to the front board module 11. The second air inlet 14 communicates with the front board module 11...

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Abstract

The invention provides a heat dissipation structure and communication equipment. The heat dissipation structure comprises a casing, a front plugboard module, a rear plugboard module, a first air exhaust device and a second air exhaust device, wherein the front plugboard module and the rear plugboard module are separately arranged on the front and rear ends of the casing; the casing is provided with a first air inlet corresponding to the rear plugboard module, the first air inlet is communicated with the rear plugboard module, the casing is provided with a second air inlet corresponding to thefront plugboard module, and the second air inlet is communicated with the front plugboard module; the casing is also provided with a first channel and a second channel; and the first air exhaust device and the second air exhaust device are both arranged at the rear end of the casing, the first air exhaust device directly faces the first channel, and the second air exhaust device directly faces thesecond channel. Therefore, by arranging a first heat dissipation path and a second heat dissipation path that do not interfere with each other in the heat dissipation structure, the heat dissipationefficiency of the heat dissipation structure can be effectively improved.

Description

technical field [0001] The invention relates to the field of heat dissipation of communication equipment, in particular to a heat dissipation structure and communication equipment. Background technique [0002] With the development and progress of science and technology, communication technology has developed rapidly and made great progress, and the functions of communication equipment are becoming more and more comprehensive. As the functions of communication equipment become more and more comprehensive, the performance requirements of communication equipment for heat dissipation are also increasing. high. [0003] The heat dissipation structure of the communication equipment includes a housing, a front board module placed horizontally is arranged at the front of the housing, a rear board module is arranged orthogonal to the front board module at the rear of the housing, the front, A backplane is provided between the rear board modules, and signal transmission is realized ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20145
Inventor 杨立波么东升高磊
Owner ZTE CORP
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