Heat dissipation structure and communication equipment

Abstract

The invention provides a heat dissipation structure and communication equipment. The heat dissipation structure comprises a casing, a front plugboard module, a rear plugboard module, a first air exhaust device and a second air exhaust device, wherein the front plugboard module and the rear plugboard module are separately arranged on the front and rear ends of the casing; the casing is provided with a first air inlet corresponding to the rear plugboard module, the first air inlet is communicated with the rear plugboard module, the casing is provided with a second air inlet corresponding to thefront plugboard module, and the second air inlet is communicated with the front plugboard module; the casing is also provided with a first channel and a second channel; and the first air exhaust device and the second air exhaust device are both arranged at the rear end of the casing, the first air exhaust device directly faces the first channel, and the second air exhaust device directly faces thesecond channel. Therefore, by arranging a first heat dissipation path and a second heat dissipation path that do not interfere with each other in the heat dissipation structure, the heat dissipationefficiency of the heat dissipation structure can be effectively improved.

Description

technical field [0001] The invention relates to the field of heat dissipation of communication equipment, in particular to a heat dissipation structure and communication equipment. Background technique [0002] With the development and progress of science and technology, communication technology has developed rapidly and made great progress, and the functions of communication equipment are becoming more and more comprehensive. As the functions of communication equipment become more and more comprehensive, the performance requirements of communication equipment for heat dissipation are also increasing. high. [0003] The heat dissipation structure of the communication equipment includes a housing, a front board module placed horizontally is arranged at the front of the housing, a rear board module is arranged orthogonal to the front board module at the rear of the housing, the front, A backplane is provided between the rear board modules, and signal transmission is realized ...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the embodiments of the present invention is to provide a heat dissipation architecture and communication equipment, which solves the problem of low heat dissipation efficiency of the heat dissipation architecture

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