Laser sealing device and packaging method of semiconductor device

Abstract

The invention provides a laser sealing device and a packaging method of a semiconductor device. The laser sealing device comprises a laser source and a baffle plate, wherein a moving path of the lasersource comprises a power increasing section, a power reducing section and a rated section which are circularly connected sequentially in a moving direction, the power increasing section has a first start point and a first end point in the moving direction, the power reducing section has a second start point and a second end point in the moving direction, and the first end point is coincident withthe second start point; the baffle plate is arranged between the laser source and the semiconductor device; the baffle plate can move between a first shielding position and a second shielding position to respectively shield the power increasing section and the power reducing section; when the baffle plate is in the first shielding position, the laser source is moved to the first start point for the first time and starts from the first start point, and the power is increased from zero to a rated value when the power is moved to the first end point; when the baffle plate is in the second shielding position, the laser source is moved from the first start point to the first end point again, and the power is the rated value; and when the laser source is moved from the second start point to thesecond end point again, the power is reduced from the rated value to zero.

Description

technical field [0001] The present disclosure relates to semiconductor device manufacturing equipment and methods, in particular to a laser sealing device and a semiconductor device packaging method. Background technique [0002] Such as figure 1 As shown in , which representatively shows a schematic diagram of a moving path of a laser source in an existing OLED device packaging process. Such as figure 1 As shown, the existing equipment moves the laser source from the starting point P1 to the moving direction F1 along the moving path T1 under the condition that the laser scanning speed is determined, and stops the laser source after moving for a full circle and moving to the end point P2 for the second time . Since the power of the laser source in the working state needs to reach the rated value within a certain time, the distance between the starting point P1 and the ending point P2 can be calculated according to the above time and the laser scanning speed. [0003] Con...

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Problems solved by technology

[0004] Since the melt corresponding to the moving path T1 between the starting point P1 and the end point P2 is repeatedly sintered by the laser, when the equipment is abnormal or the power fluctuates, it is easy to cause the laser power in this area to be too large or too small, resulting in incomplete sintering of the melt or Overheating, resulting in air leakage in the package and the formation of Newton's rings

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