Processing and filling method for blind slot gaskets of multi-layer PCB

Abstract

The invention provides a processing and filling method for blind slot gaskets of a multi-layer PCB and belongs to the technical field of PCB production. The method comprises the following steps: 1) machining through grooves in corresponding positions of a surface substrate and a prepreg of the multi-layer PCB; 2) machining gaskets on a gasket substrate, and reserving reinforcing ribs between the gaskets and the gasket substrate; 3) attaching a cover film to the upper surface of the surface substrate; 4) placing the gasket substrate on the surface substrate, aligning the gaskets with the through holes in the surface substrate and performing filling; 5) removing the reinforcing ribs of the gaskets and redundant gasket material; 6) laminating boards according to designed board lamination sequence, removing the surface cover film after lamination, and taking out the gaskets in the through grooves to form the required blind groove structure. The cover film is used for assisting gasket filling of the blind grooves, and the problems of gasket alignment and filling caused by deformation and warping of a thin surface substrate are solved; the machined blind groove gaskets adopt the reinforcing robs for connection and positioning, batch filling is facilitated, and the method is suitable for machining mass thin blind groove structures.

Description

technical field [0001] The invention belongs to the technical field of multilayer PCB production, in particular to a method for processing and filling multilayer PCB blind slot gaskets. Background technique [0002] The blind slot of a multi-layer PCB refers to a local area on the printed board that is formed by lamination, milling, etc. and has different heights. The main functions of the blind slot are as follows: one is to realize the input and output ports of the internal electrical signals of each layer; the other is to serve as a cavity and carrier for pasting and mounting chips, capacitors, resistors and other components; the third is to serve as a microwave component interconnection Connected channels are cascaded through gold wires, gold belts, etc. [0003] Filling blind slots with gaskets and taking out the gaskets after pressing is one of the blind slot processing methods widely used in the PCB industry at present. It is more suitable for blind slots with a proc...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for processing and filling multi-layer PCB blind groove gaskets, using "reinforcing ribs" to obtain integral filling gaskets, and using cover films to assist batch filling of blind groove gaskets, which can effectively solve the problems of the prior art Difficulty in gasket filling when processing thin and large number of blind groove structures

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