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A preparation method of epoxy resin potting material suitable for high impact pressure environment and strong electric field resistance

A technology of epoxy resin and potting materials, which is applied in the field of insulating materials, can solve problems such as failure of insulation performance, difficulty in meeting the needs of impact high-voltage environments, and affecting product quality and service stability.

Active Publication Date: 2020-11-13
INST OF FLUID PHYSICS CHINA ACAD OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the problem that the existing epoxy resin material loses its insulation performance under the action of electric field loading, which affects product quality and service stability, and the existing epoxy resin is difficult to meet the needs of the impact high-voltage environment. A preparation method of epoxy resin potting material suitable for high impact pressure environment and strong electric field resistance

Method used

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  • A preparation method of epoxy resin potting material suitable for high impact pressure environment and strong electric field resistance

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] (one) embodiment 1 sample 1#

[0047] (1) Preparation of component A of epoxy resin by solution blending method

[0048] Blend and compound epoxy resin E44 and polyethylene glycol diglycidyl ether, the mixing mass ratio is 50:6, and stir at 75°C for 5 minutes to obtain a blended solution. After cooling, epoxy resin A is formed. Component.

[0049] (2) Preparation of curing agent B component by the eutectic method of aromatic amine

[0050] Heat diaminodiphenylmethane and o-phenylenediamine to co-melt, the mixing mass ratio is 2:2, heat and co-melt at 120°C for 10 minutes, and form a low-viscosity co-melt after cooling to obtain curing agent B component.

[0051] (3) Mix the obtained epoxy resin component A and curing agent B component, the mixing mass ratio is 11:2, and stir at 80°C for 3 minutes to obtain the third mixed liquid.

[0052](4) Add the accelerator 2,4,6-tris(dimethylaminomethyl)phenol and filler micron alumina powder to the third mixed solution in seque...

Embodiment 2

[0056] Example 2 Sample 2#

[0057] (1) Preparation of component A of epoxy resin by solution blending method

[0058] Blend and compound epoxy resin E44 and polyethylene glycol diglycidyl ether, the mixing mass ratio is 50:8, stir at 95°C for 5 minutes to obtain a blended solution, and form epoxy resin A after cooling Component.

[0059] (2) Preparation of curing agent B component by the eutectic method of aromatic amine

[0060] Heat diaminodiphenylmethane and o-phenylenediamine to co-melt, the mixing mass ratio is 2:2, heat and co-melt at 150°C for 10 minutes, and form a low-viscosity co-melt after cooling to obtain curing agent B component.

[0061] (3) Mix the obtained epoxy resin component A and curing agent B component, the mixing mass ratio is 11:2, and stir at 100°C for 5 minutes to obtain the third mixed solution.

[0062] (4) Add the accelerator 2,4,6-tris(dimethylaminomethyl)phenol and filler micron alumina powder to the third mixed solution in sequence, keep th...

Embodiment 3

[0066] Example 3 Sample 3#

[0067] (1) Preparation of component A of epoxy resin by solution blending method

[0068] Blend and compound epoxy resin E44 and polyethylene glycol diglycidyl ether, the mixing mass ratio is 50:7, and stir at 75°C for 5 minutes to obtain a blended solution. After cooling, epoxy resin A is formed. Component.

[0069] (2) Preparation of curing agent B component by the eutectic method of aromatic amine

[0070] Heat diaminodiphenylmethane and o-phenylenediamine to co-melt, the mixing mass ratio is 2:2, heat and co-melt at 140°C for 10 minutes, and form a low-viscosity co-melt after cooling to obtain curing agent B component.

[0071] (3) Mix the obtained epoxy resin component A and curing agent B component, the mixing mass ratio is 11:2, and stir at 100°C for 3 minutes to obtain the third mixed liquid.

[0072] (4) Add the accelerator 2,4,6-tris(dimethylaminomethyl)phenol and filler micron alumina powder to the third mixed solution in sequence, ke...

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Abstract

The invention discloses a preparation method of a highfield-resistant epoxy resin encapsulating material suitable for a high impact pressure environment, and aims to solve the problems of an existingepoxy resin material that under the loading action of an electric field, the insulating property is invalid, the quality and the using stability of products are affected, and the requirements of an impact high-pressure environment are difficult to meet by existing epoxy resin. The preparation method comprises the following steps: preparing an epoxy resin component A through a solution blending method; preparing a curing agent component B by utilizing an eutectic point method of aromatic amine; mixing and stirring with an accelerator and aluminum oxide powder in proportions, thus preparing a pouring turbid solution; slowly injecting the pouring turbid solution in a mold cavity, putting a mold in a vacuum drying oven for defoaming, and putting the defoamed mold in a drying oven for curing, thus preparing cured epoxy resin. Actual measurement shows that the preparation method disclosed by the invention is simple, has better insulating property for the impact high-pressure environment, canbe widely applied to the field of high-voltage insulated encapsulation having impact pressure coupling and has higher application value.

Description

technical field [0001] The invention relates to the field of insulating materials in impact high-voltage environments, in particular to a preparation method of an epoxy resin potting material suitable for high impact pressure environments and resistant to strong electric fields. The invention provides a preparation method of an epoxy resin potting material, its product and its application in a strong electric field environment, which is suitable for a high impact pressure environment and has the characteristic of strong electric field resistance. The invention obtains the epoxy resin cured product with excellent insulation performance in the impact high-voltage environment for the first time, and has extremely high application value and application prospect. Background technique [0002] The molecular structure of epoxy resin contains two or more epoxy groups, which can undergo cross-linking reactions with various types of curing agents such as amines and acid anhydrides to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K3/22C08G59/50
CPCC08G59/5033C08K2003/2227C08L63/00C08L2205/025C08K3/22
Inventor 高刘德高志鹏王海晏刘高旻谢庆海谷伟韩旭李兴刘艺杨佳
Owner INST OF FLUID PHYSICS CHINA ACAD OF ENG PHYSICS