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Device and method for thermal machining

A processing area and aspect technology, applied in the field of devices and methods for thermal processing, can solve problems such as insufficient adjustment

Inactive Publication Date: 2018-11-23
КЬЕЛЛЬБЕРГ-ШТИФТУНГ
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, many methods have the disadvantage that the laser radiation is only roughly adjustable from the outside with regard to its intensity, especially with regard to the local intensity distribution, but to an insufficient degree

Method used

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  • Device and method for thermal machining
  • Device and method for thermal machining
  • Device and method for thermal machining

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Embodiment Construction

[0081] figure 1 The radiation source 5 is shown in a schematic side view, which emits a laser beam 6 onto a processing area 1 which is located on the surface 2 of the workpiece. In the exemplary embodiment shown, when the laser beam 6 leaves the radiation source 5, the laser beam 6 is already focused on the workpiece surface 2; that is, it does not require any other arrangement in the beam path outside the radiation source 5 Optical element. For the purpose of setting the intensity of the laser beam 6, an optical filter 12 that is adjustable in terms of filtering effect is located in the beam path of the laser beam as an intensity reduction element. However, in other exemplary embodiments, instead of or in addition to the optical filter 12, a polarizer, a pair of polarizers (in each case, with a different polarization axis), a diaphragm, a general The beam trap of the laser beam 6 is partially shielded, or the shutter is preferably rotated. The device shown can be used to se...

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Abstract

The invention relates to a device and a method for thermal machining in a machining region (1) on a workpiece surface (2) by means of a laser beam (6) emitted by at least one radiation source (5). Atleast one element (10, 11, 12) is arranged in the beam path of the laser beam (6), between the at least one radiation source (5) and the machining region (1) on the workpiece surface (2), said elementbeing used to modify the intensity of the laser beam (6) in the machining region (1) in a locally defined manner. Alternatively or additionally, the intensity of at least one of the laser beams (6) in the machining region (1) can be modified in a locally defined manner, by means of a defined control of a plurality of radiation sources (5), such that a locally defined distribution of the intensityof the laser beam (6) hitting the workpiece surface (2) can be obtained in the machining region (1).

Description

Technical field [0001] The present invention relates to a device and method for thermal processing in a processing area of ​​a workpiece surface by means of a laser beam emitted by at least one radiation source. Background technique [0002] Laser radiation is generally used for processing workpieces, for example for welding, cutting or coating. Here, the energy introduced by laser radiation brings about a welcome change in the material. However, the disadvantage of many methods is that the laser radiation can be roughly adjusted from the outside only in terms of its intensity, especially in terms of local intensity distribution, but can be adjusted to an insufficient degree. Generally, in this case, the intensity distribution follows the Gaussian distribution in the focal point. Summary of the invention [0003] Therefore, the present invention is based on the purpose of developing a device and method by means of which a defined local influence on the intensity of laser radiati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/06B23K26/073B23K26/064B23K26/066B23K26/03
CPCB23K26/034B23K26/0604B23K26/0648B23K26/0652B23K26/0734B23K26/064B23K26/066B23K26/0626
Inventor 迈克尔·施尼克尼尔斯·布罗克
Owner КЬЕЛЛЬБЕРГ-ШТИФТУНГ