Glue filling method and glue solidifying method
A filling method and glue technology, applied in the direction of surface pretreatment, coating, and devices for coating liquid on the surface, etc., can solve problems such as failure to meet rigid requirements, reduced deformation capacity, and high risk of device damage and failure, and achieve The effect of reducing voids, improving the ability to deform, and reducing the risk of damage and failure
Inactive Publication Date: 2018-11-30
KUNSHAN Q TECH CO LTD
View PDF1 Cites 2 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
The existence of voids significantly reduces the deformation ability of the device against external impact, and the risk of device damage and failure is greater; at the same time, the existing glue filling method makes the glue only seal around the component, and the device resists external acid and alkali, sweat, moisture, etc. The ability of impurities is poor, which cannot meet the rigid requirements of "waterproof" for today's electronic products
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0036] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.
[0037] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides a glue filling method and a glue solidifying method and relates to the technical field of semiconductors. The glue filling method includes: dispensing glue, to be more specific,filling glue in an area between components and a circuit board; solidifying, to be more specific, preheating the components and the circuit board after the glue filling, and standing the preheated components and circuit board for a preset time period under the activation temperature of the glue. The glue filling method and the glue solidifying method have the advantages that the glue can be sufficiently filled between the components and the circuit board, voids inside the glue can be reduced, and the external impact resistance and external impurity resistance of the components can be increased.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to a glue filling method and a glue curing method. Background technique [0002] Glue filling is a very time-consuming process. Although various glue filling processes such as no-flow and wafer-level processes have emerged, the traditional capillary flow glue filling process still dominates the industry today. [0003] One of the main problems of the capillary flow glue filling process is insufficient glue filling and voids, especially for smaller device-substrate gaps and devices with more solder joints, the void problem is more serious. The liquid glue material flows unevenly in the gap between the device and the substrate, and the flow speed changes in the area with solder joints. At the same time, the flow near the edge of the device is often faster than the middle. In addition, the surface environment of the device and the substrate changes, such as flux. The presence o...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): B05D3/00B05D3/02
CPCB05D3/002B05D3/0218B05D3/0254
Inventor 盛信通
Owner KUNSHAN Q TECH CO LTD