Elastic hook heat sink structure

Abstract

A spring hook type cooling fin structure comprises a cooling fin, a spring hook and a rotation shaft. One end of the rotation shaft is connected to the cooling fin and the other end is connected to the spring hook. The spring hook can rotate along the rotation shaft. By using the spring hook type cooling fin structure, after the spring hook is assembled with the spring hook in a PCB, even if thereis horizontal tension, a cooling fin body is not affected, and the cooling fin can still maintain an original fixed position so as to improve the deflection condition of traditional spring hook typecooling fin assembling.

Description

technical field [0001] The invention relates to heat sinks, in particular to a snap-hook type heat sink structure. Background technique [0002] At present, the common spring-hook heat sink on the market is composed of a metal spring hook and the body of the heat sink riveted together. When the heat sink is assembled, the hooks at both ends of the spring hook are fastened and fixed with the corresponding spring hooks on the PCB. [0003] After the existing snap-hook heat sink is assembled, due to the symmetry of the snap-hook process, the force on the heat sink is not only the original vertical compression force, but also the tension in the X-Y direction, which leads to the heat sink being fixed. Afterwards, there will be a deflection situation, so that the chip and the heat sink cannot be bonded in the correct position, which will affect the heat dissipation effect. Contents of the invention [0004] In view of this, it is necessary to provide a spring-hook type heat sin...

AI Technical Summary

Problems solved by technology

[0003] After the existing snap-hook heat sink is assembled, due to the symmetry of the snap-hook process, the force on the heat sink is not only the original vertical compression force, but also the tension in the X-Y direction, which in turn causes the heat sink to be fixed. Afterwards, there will be a deflection situation, so that the chip and the heat sink cannot be bonded in the correct position, which will affect the heat dissipation effect

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