Chip mounting system and chip mounting method
A chip mounting and chip technology, applied in the direction of semiconductor devices, electrical components, electrical components, etc., can solve problems such as changing limits
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no. 1 example
[0045] see Figure 10 to Figure 12 As shown, the first embodiment of the present invention provides a chip acquisition device D3 , and the chip acquisition device D3 includes a position detection module 1 and a chip separation module 2 . In addition, the chip acquisition device D3 can be applied to process a semiconductor structure S, and the semiconductor structure S includes a base layer S10 and a plurality of light-emitting chips S11 disposed on the base layer S10 . For example, the base layer S10 can be a quartz base layer, a glass base layer, a sapphire base layer, a silicon base layer or any material base layer. In addition, a plurality of light-emitting chips S11 may be in a state before dicing and present an appearance of being connected to each other, or a plurality of light-emitting chips S11 may be in a state after dicing and present an appearance of being separated from each other (like the example currently used in the present invention ). The light-emitting chi...
no. 2 example
[0051] see Figure 13 As shown, the second embodiment of the present invention provides a chip acquisition device D3 , and the chip acquisition device D3 includes a position detection module 1 and a chip separation module 2 . Depend on Figure 13 and Figure 11 The comparison shows that the biggest difference between the second embodiment of the present invention and the first embodiment is: in the second embodiment, the position detection module 1 and the chip separation module 2 are arranged on different sides of the semiconductor structure S. For example, the position detection module 1 can be disposed above the semiconductor structure S, and the chip separation module 2 can be disposed below the semiconductor structure S. Referring to FIG.
[0052] It is worth mentioning that the steps of "position detection" and "chip separation" can also be performed on the same position of the light-emitting chip S11. That is to say, the chip separation module 2 can be arranged at th...
no. 3 example
[0054] see Figure 14 As shown, the third embodiment of the present invention provides a chip acquiring device D3. Depend on Figure 14 and Figure 11 It can be seen from the comparison that the biggest difference between the third embodiment of the present invention and the first embodiment is that: the chip acquisition device D3 of the third embodiment includes: an emitting assembly 11 for generating a projection light source P, an adjacent emitting assembly 11 The receiving component 12 and a control module 3 electrically connected to the transmitting component 11 and the receiving component 12 .
[0055] Furthermore, the projection light source P generated by the emitting component 11 can be projected toward the receiving component 12 through the reflection of the semiconductor structure S, so as to provide a position information of a contact interface S100 between the base layer S10 and the light emitting chip S11 . In this way, the projection light source P generated...
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