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Packaging method and display panel

A display panel and packaging method technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of display panel substrate corrosion damage, packaging film can not effectively block water vapor, etc., to reduce the probability of peeling phenomenon, tightly bonded, improve The effect of the ability to withstand external forces

Active Publication Date: 2021-01-15
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of the shortcomings of the existing methods, this application proposes a packaging method and a display panel to solve the technical problem in the prior art that the packaging film cannot effectively block water vapor and cause the substrate in the display panel to be corroded and damaged

Method used

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  • Packaging method and display panel
  • Packaging method and display panel
  • Packaging method and display panel

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Embodiment Construction

[0035] The present application is described in detail below, and examples of embodiments of the present application are shown in the drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Also, detailed descriptions of known technologies will be omitted if they are not necessary to illustrate the features of the present application. The embodiments described below by referring to the figures are exemplary only for explaining the present application, and are not construed as limiting the present application.

[0036] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be ...

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Abstract

Embodiments of the present application provide a packaging method and a display panel. The packaging method includes: providing a substrate to be packaged and a cover plate; forming an inorganic packaging layer on the substrate to be packaged; forming an inorganic packaging layer containing a photosensitive material on the inorganic packaging layer. The intermediate layer is irradiated with light of a preset wavelength to form a bonding layer; an organic encapsulation layer is formed on the bonding layer; a preset temperature treatment process is implemented so that the photosensitive material in the bonding layer is respectively combined with the inorganic encapsulation layer and the organic encapsulation layer combined to form an encapsulation film. The bonding layer makes the inorganic encapsulation layer and the organic encapsulation layer more tightly combined, improves the ability of the encapsulation film to withstand external forces, reduces the probability of peeling at the interface between the inorganic encapsulation layer and the organic encapsulation layer, and improves the barrier of the encapsulation film As a result, the encapsulation method is used to form the encapsulation film on the substrate in the display panel, which can effectively prevent water vapor and oxygen from contacting the substrate, and prevent the substrate from being corroded and damaged.

Description

technical field [0001] The present application relates to the technical field of display panel packaging, and in particular, the present application relates to a packaging method and a display panel. Background technique [0002] OLED (Organic Light-Emitting Diode, organic light-emitting semiconductor or organic electro-laser display) is a display lighting technology that has gradually developed in recent years. It is widely used due to its advantages of high response, high contrast and flexibility. Especially in the field of display, the application prospect of OLED is very broad. For example, the current booming display panel generally adopts related technology of OLED. [0003] Since OLED devices are prone to corrosion and damage under the action of water vapor and oxygen, effective packaging must be implemented for display panels using OLED devices. In order to adapt to the flexible feature of the display panel, the packaging film of the display panel also needs to have...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L27/32
CPCH10K59/00H10K50/84H10K50/844
Inventor 王琳琳
Owner BOE TECH GRP CO LTD
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