Wafer defect detection system, detection method and computer storage medium

Abstract

The invention provides a wafer defect detection system and detection method and a computer storage medium. The wafer defect detection method comprises the following steps: establishing a grid coordinate system on a wafer defect scanning system to scan and obtain each defect on the wafer surface and coordinates of each defect in the grid coordinate system; screening out a first class of defects from the respective defects according to the coordinates of the respective defects in the grid coordinate system; screening out a second class of defects from all the first class of defects; setting Thenumber of defects constituting each of the chain defects is set in advance, and screening out the chain defects from all the second type defects according to the number of defects; And outputting a diagnosis result of the chain defects according to the selected number of the chain defects. The technical proposal of the invention can effectively detect and screen the chain defects on the wafer so as to realize effective specification control of the chain defects.

Description

technical field [0001] The invention relates to the field of semiconductor technology manufacturing, in particular to a wafer defect detection system, a detection method and a computer storage medium. Background technique [0002] In the manufacturing process of semiconductor integrated circuits, defect detection has become an important means to improve yield. At present, defect scanning in the industry usually adopts the methods of total count, add count, and repeat count, and uses the machine's self-classification software to classify (based on pixel size, shape and size, etc.) to classify. Defect control is carried out in the form of rough bins. Conventional defects such as defect positions appearing randomly on the wafer can be set in these conventional ways to achieve systematic defect detection. However, for defects with a special distribution map (special map) such as chain defects, there must be a higher standard (level) in handling. Although this kind of chain def...

AI Technical Summary

Problems solved by technology

However, for defects with a special map like chain defects, higher standards (level) are required for handling

Although this kind of chain defect with a special map can be scanned by the machine, it is not defined and mixed with conventional defects, so it is not possible to set a separate specification to judge whether it exceeds the specification (out of spec), therefore, if the existing total count (total count) and other conventional methods are used to detect, it is easy to make the total count of conventional defects and chain defects not reach the early warning standard, which will lead to the inability to Detect and alarm this chain defect

At present, there is no relevant and targeted means for self-inspection of chain defects, especially in the case of many conventional defects, it is impossible to detect chain defects effectively and accurately

Images