Semiconductor refrigeration suction cup

A frozen sucker and semiconductor technology, applied in the direction of workpiece clamping devices, manufacturing tools, etc., can solve the problems of affecting the processing quality of components, brittle material collapse, and many processing procedures, so as to improve processing quality, reduce collapse, and scope of application wide effect

Pending Publication Date: 2019-01-04
TIANJIN UNIV OF TECH & EDUCATION TEACHER DEV CENT OF CHINA VOCATIONAL TRAINING & GUIDANCE +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] In related technologies, it is difficult to clamp when processing precious metals, non-metallic materials, flexible materials and small parts
For example, square ceramic products with a side length of 5 mm have many processing proce

Method used

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  • Semiconductor refrigeration suction cup
  • Semiconductor refrigeration suction cup
  • Semiconductor refrigeration suction cup

Examples

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Example Embodiment

[0025] The following describes the embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions. The following embodiments described with reference to the accompanying drawings are exemplary, and are only used to explain the present invention, and cannot be understood as a limitation to the present invention.

[0026] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " "Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise" and other directions or The positional relationship is based on the position or positional relationship shown in the drawings, and is only for the convenience of describing the present...

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Abstract

The invention discloses a semiconductor refrigeration suction cup. The semiconductor refrigeration suction cup comprises a base, the base is of a hollow structure and is internally provided with an installation board, and the installation board is provided with a plurality of round holes and rectangular holes. The installation board is provided with a heat dissipation plate, a semiconductor combination sheet and a cold energy guiding board from bottom to top in sequence. The heat dissipation plate is internally provided with a liquid circulation channel, and the round holes and the rectangularholes communicate with the liquid circulation channel. The semiconductor combination sheet comprises a first semiconductor and a second semiconductor, and the first semiconductor and the second semiconductor are arranged in a spaced mode and made of different materials. A plurality of liquid storage grooves are formed in the upper surface of the cold energy guiding board and filled with connection media. According to the semiconductor refrigeration suction cup, by utilizing the Peltier effect, cold energy is transmitted to the connection media through the water storage type cold energy guiding board, the connection media are solidified into ice so that a to-be-fixed element can be fixed, non-stress clamping is achieved, the fragile material edge collapsing phenomenon is decreased, and theelement machining quality is improved.

Description

technical field [0001] The invention relates to the processing fields of small precision parts such as aerospace, microelectronics, solar energy, mobile phone parts, medical treatment, jewelry processing, etc., and particularly relates to a semiconductor freezing sucker. Background technique [0002] In related technologies, it is difficult to clamp precious metals, non-metallic materials, flexible materials and small parts during processing. For example, square ceramic products with a side length of 5 mm have many processing procedures. The use of traditional vises, vacuum chucks and permanent magnetic chucks will cause stress changes in ceramic products, and at the same time cause brittle materials to collapse, which will affect the processing quality of components. Contents of the invention [0003] A semiconductor freezing chuck provided by an embodiment of the present invention includes a base, the base is hollow and has a built-in mounting plate, and the mounting pla...

Claims

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Application Information

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IPC IPC(8): B25B11/00
CPCB25B11/00
Inventor 李占杰黄旭栋靳刚
Owner TIANJIN UNIV OF TECH & EDUCATION TEACHER DEV CENT OF CHINA VOCATIONAL TRAINING & GUIDANCE
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