A display device and its manufacturing method

Abstract

An embodiment of the present invention provides a display device, which relates to the field of display technology and can improve the light leakage problem of the display device. It includes a display panel, the display panel is divided into a display area and a non-display area, and the non-display area includes a binding area, and also includes a driving circuit board bound to the binding area, and extending from the display area to The light-transmitting layer on the driving circuit board, the light-transmitting layer covering the driving circuit board; the part of the light-transmitting layer covering the driving circuit board is the first part, and the first part does not exceed the display The edge of the panel, the transparent layer includes a hollow part, the hollow part is located on the side of the driving circuit board close to the display area, and one side wall of the hollow part is close to the display area by the driving circuit board The boundary of and the first portion is formed close to the boundary of the display area.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a display device and a preparation method thereof. Background technique [0002] Since the flexible substrate of the flexible display device can be bent or even folded, it can meet consumers' needs of wearing the flexible display device on the body and being convenient to carry. [0003] In a conventional display device, a flexible printed wiring (FPC) is usually arranged on a side of the array substrate close to the opposite substrate, and the FPC is bent to the side of the array substrate. If the substrate of the array substrate is a flexible material, the substrate of the array substrate will also be bent when the FPC is bent. Therefore, if figure 1 As shown, usually the adhesive layer 13 is used to fix the FPC 12 on the array substrate 11 , and then the FPC 12 is bent. [0004] However, if figure 2 As shown, when the adhesive layer 13 is formed on the array subst...

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Problems solved by technology

[0004] However, if figure 2 As shown, when the adhesive layer 13 is formed on the array substrate 11 provided with the FPC12, since the FPC12 has a certain thickness, there will be a certain level difference on the side of the FPC12, that is, the adhesive layer 13 cannot be completely bonded to the side of the FPC12. , so that the surface of the adhesive layer 13 at the climbing position of the FPC12 is an inclined plane, along the direction from the non-display area to the display area, and the projected width of the inclined plane on the flexible substrate is 0.6-1 mm. The surface of the slope is uneven, so that part of the large-angle light emitted from the display area of ​​the display device hits the slope of the adhesive layer 13 and is diffusely reflected by the slope. If part of the light hits the visible area, then This part of the light will not be blocked by the ink in the ink area, and then emitted from the visible area. However, only the operable area in the visible area is used for display. Therefore, if the light is emitted from the area other than the operable area in the visible area , will cause light leakage and affect user experience

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