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A kind of array substrate and preparation method thereof

An array substrate and substrate technology, applied in the field of array substrates and its preparation, can solve the problems of difficulty in meeting the flexible requirements of OLED panels and increasing the stress of the film layer, so as to achieve the effect of improving flexibility and avoiding damage

Active Publication Date: 2021-07-27
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention provides an array substrate, a preparation method thereof, and a display panel to solve the problem that the inorganic film layer in the existing flexible OLED panel increases the stress of the film layer, so that it is difficult to meet the flexible requirements of the OLED panel

Method used

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  • A kind of array substrate and preparation method thereof
  • A kind of array substrate and preparation method thereof
  • A kind of array substrate and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0050] figure 1 A schematic cross-sectional view of an array substrate according to Embodiment 1 of the present invention is shown. refer to figure 1 , the array substrate includes a substrate 10, and an electronic device formed on the substrate 10 and a first composite layer 20 between adjacent electronic devices, wherein the first composite layer 20 includes at least an organic planar layer 30, that is, it can Part or all of the originally formed inorganic film layers between adjacent electronic devices can be replaced by the highly flexible organic flat layer 30, so that part of the stress on the array substrate can be released, thereby improving the flexibility of the entire display panel, and avoiding electronic devices due to bent and damaged. In the actual preparation process of the array substrate, after the inorganic film layer is formed between adjacent electronic devices, part or all of the inorganic film layer can be removed to form a film layer gap, and then the...

Embodiment 2

[0062] refer to image 3 , shows a flow chart of the steps of a method for manufacturing an array substrate according to Embodiment 2 of the present invention, and the method may include the following steps:

[0063] Step 301: Provide a base.

[0064] In the embodiment of the present invention, the base may be a flexible base, or a rigid base with relatively high flexibility.

[0065] Step 302: forming electronic devices and inorganic composite layers between the electronic devices on the substrate.

[0066] In the embodiment of the present invention, the electronic device may include a thin film transistor, a storage capacitor and wiring. Specifically, refer to Figure 4 , an inorganic isolation buffer layer can be formed on the substrate first, and then an active layer can be formed on the inorganic isolation buffer layer through a patterning process, and then a first inorganic gate insulating layer can be formed, wherein the first inorganic gate insulating layer covers t...

Embodiment 3

[0079] The embodiment of the present invention also discloses a display panel, including the above-mentioned display substrate.

[0080] In an embodiment of the present invention, the array substrate of the display panel may include a base, electronic devices formed on the base, and a first composite layer located between adjacent electronic devices, wherein the first composite layer includes at least an organic planar layer. In the embodiment of the present invention, part or all of the originally formed inorganic film layers between adjacent electronic devices can be replaced by a highly flexible organic flat layer, so that part of the stress on the array substrate can be released and the electronic devices can be avoided due to bending. The damage improves the flexibility of the entire display panel.

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Abstract

The invention provides an array substrate and a preparation method thereof, and relates to the field of display technology. Wherein, the array substrate includes a base; electronic devices formed on the base and a first composite layer located between adjacent electronic devices; wherein, the first composite layer includes at least an organic planar layer. In the embodiment of the present invention, part or all of the originally formed inorganic film layers between adjacent electronic devices can be replaced by a highly flexible organic flat layer, so that part of the stress on the array substrate can be released and the electronic devices can be avoided due to bending. The damage improves the flexibility of the entire display panel.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to an array substrate and a preparation method thereof. Background technique [0002] Organic Electroluminescent Display (OLED) has gradually become the mainstream in the field of display due to its low power consumption, high color saturation, wide viewing angle, thin thickness, and flexibility. Terminal products such as smartphones, tablets, and TVs. Among them, flexible OLED panels have gradually become the mainstream of OLED panels because of their high flexibility and ability to meet various special structures. [0003] Current flexible OLED panels usually include multiple layers of highly flexible organic film layers and multi-layer inorganic film layers, and the inorganic film layers are usually very dense, thus increasing the film stress in the flexible OLED panel, thus making the flexible OLED The bendability of the panel is not good, and it is easy to cause crac...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/12H01L21/77H01L27/32
CPCH01L27/1214H01L21/77H10K59/12
Inventor 田宏伟牛亚男李栋王纯阳刘政
Owner BOE TECH GRP CO LTD