Method for manufacturing ultra-thin temperature sensor, and temperature sensor

Abstract

The invention discloses a method for manufacturing an ultra-thin temperature sensor, comprising: A, soldering a thermosensitive chip on a circuit carrier; B, fixing the soldered thermosensitive chip by a packaging process; C, grinding the thermosensitive chip from the upper surface of the thermosensitive chip in order that the thickness of the grinded thermosensitive chip is 10 to 150 [mu]m. The novel temperature sensor manufacturing method provided by the invention introduces a PCBA process to rapidly mount a commercially available thermosensitive chip on the circuit carrier, introduces a molding process in the packaging process to fix the thermosensitive chip to the circuit carrier under certain temperature and pressure, and then introduces a new grinding process to grind the molding glue and the thermosensitive chip to a thickness of 10 to 150 [mu]m which is as low as 1/30 to 1/2 of the original thickenss of the thermosensitive chip. Thus, an ultra-thin high-precision and fast-responding temperature sensor is obtained. The method overcomes the size limitation of the thermosensitive chip in the prior art. The present invention also provides a temperature sensor manufactured by the method.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to an ultra-thin temperature sensor manufacturing method and the temperature sensor. Background technique [0002] Temperature sensors are widely used in every aspect of our lives. [0003] In the prior art, discrete thermal chip temperature sensors (such as electronic thermometers) are commonly used. Discrete thermal chip temperature sensors are generally packaged twice with thermal chips, and the response speed is relatively slow and the accuracy is low. Not high, it takes about 30 seconds to 10 minutes for the discrete thermal chip temperature sensor to obtain a stable and relatively accurate temperature. For example, a medical electronic thermometer requires at least 3 minutes to read the data when it is clamped under the armpit. [0004] These problems are determined by the system structure and process of the prior art, and are specifically described as follows: the discrete t...

AI Technical Summary

Problems solved by technology

In the prior art, lead wires need to be soldered on both sides of the thermosensitive chip, which limits the minimum size of the thermosensitive chip. The size of the sensitive chip is 0.6 mm×0.3 mm×0.3 mm; the size of the thermal chip cannot be further reduced in the prior art

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