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Metal mold for testing height of packaging housing lead and use method thereof

A technology of encapsulating shells and metal molds, applied in the direction of mechanical devices, measuring devices, mechanical measuring devices, etc., can solve the problems of inaccurate measurement values, lead wire deformation, low efficiency, etc., to ensure accuracy, avoid multiple measurements, The effect of improving inspection efficiency

Pending Publication Date: 2019-03-08
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method has the following problems: 1. It is difficult to measure the size directly. It needs to measure several sizes and then obtain it through calculation. In this way, there is an accumulated error, which leads to inaccurate measurement values; The risk of damaging the lead wire and deforming it will affect the appearance quality
This method usually measures the height difference between the bottom plane of the heat sink and the plane of the lower surface of the lead. The measured value is more accurate, but the efficiency is low

Method used

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  • Metal mold for testing height of packaging housing lead and use method thereof
  • Metal mold for testing height of packaging housing lead and use method thereof
  • Metal mold for testing height of packaging housing lead and use method thereof

Examples

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Embodiment Construction

[0016] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0017] Such as figure 1 As shown, the metal mold used for inspecting the lead height of the package casing according to the present invention is provided with the first metal part P1, the second metal part P2 and the third metal part P3 in sequence from top to bottom. The first metal part P1 uses standard-sized screws for fixing the second metal part P2 and the third metal part P3. After the specification of the first metal part P1 is determined, the dimensions of the screw holes of the second metal part P2 and the third metal part P3 should match it.

[0018] Such as figure 2 As shown, the package housing includes leads, porcelain and heat sink. The dimensions of the package case include the overall length l 2 , lead length l 1 , lead width w, lead height h to ground, lead thickness t.

[0019] Such as image 3 As sho...

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Abstract

The invention discloses a metal mold for testing height of a packaging housing lead and a use method thereof. The metal mold comprises a metal component P1, a metal component P2, and a metal componentP3, wherein the metal component P1, the metal component P2 and the metal component P3 are successively arranged from top to bottom. According to the above-ground height and thickness dimension of a packaging housing lead, the key dimension of the metal mold is designed. The packaging housing is placed on the plane of the metal mold and the metal mold is inclined, and the housing with the lead height that satisfies a requirement can slide into the trough of the mold, thereby realizing a lead height checking purpose. The mold can be used for performing quick checking on the lead height, therebygreatly improving checking efficiency.

Description

technical field [0001] The invention belongs to the field of package shell inspection, and in particular relates to a metal mold for testing the lead height of a package shell and a use method thereof. Background technique [0002] The inspection of the height of the lead wires of the package case to the ground is currently mostly carried out by means of vernier caliper measurement. This method has the following problems: 1. It is difficult to measure the size directly. It needs to measure several sizes and then obtain it through calculation. In this way, there is an accumulated error, which leads to inaccurate measurement values; The risk of damaging the lead wire and deforming it will affect the appearance quality. [0003] There is also a method of inspection using a coordinate measuring machine. This method usually measures the height difference between the bottom plane of the heat sink and the lower surface plane of the leads, and the measured value is relatively accu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B5/02
CPCG01B5/02
Inventor 梁秋实
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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