Packaging structure of crimping device and current test method
A technology of packaging structure and crimping devices, which is applied in the field of crimping devices, can solve the problems of increasing the volume of crimping devices and decreasing power density, and achieves the effects of reduced space, high power density, and convenient use
Active Publication Date: 2019-03-15
GLOBAL ENERGY INTERCONNECTION RES INST CO LTD
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Problems solved by technology
[0005] In view of this, an embodiment of the present invention provides a packaging structure and a current testing method of a crimping device to solve the problems in the prior art that the installation of the Rogowski coil causes the volume of the crimping device to increase and the power density to decrease
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[0026] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.
[0027] According to the first aspect, an embodiment of the present invention provides a package structure of a crimping device, such as figure 1 As shown, it includes several crimping chips 2 arranged on the circuit board 1, and the periphery of the circuit board 1 is provided with a number of dislocation via holes 3, and conductive wires 4 are sequentially w...
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The invention relates to the technical field of crimping devices, and specifically discloses a packaging structure of a crimping device and a current test method. The packaging structure comprises a plurality of crimping chips arranged on a circuit board, a plurality of staggered through holes are arranged at the periphery of the circuit board, and conductive lines are sequentially wound at various staggered through holes along the staggered direction to form a Rogowski coil. On the one hand, current detection can be carried out on the crimping chips on the circuit board through the Rogowski coil; on the other hand, the Rogowski coil is equivalent to being directly disposed inside the circuit board, which reduces the space occupied by the Rogowski coil, does not need to expand the size ofthe packaging structure of the entire crimping device, and can still ensure the entire high power density of the crimping device. In addition, since the Rogowski coil is directly disposed inside the circuit board, the Rogowski coil does not need to be assembled, thus the use is very convenient.
Description
technical field [0001] The invention relates to the technical field of crimping devices, in particular to a packaging structure and a current testing method of a crimping device. Background technique [0002] At present, high-power IGBT devices for power systems mainly include soldering IGBT devices and crimping IGBT devices. Among them, crimping IGBT devices are widely used because of their unique short-circuit failure mode characteristics, easy series connection, and compact structure. [0003] However, it is precisely because of the compact internal space of the crimp-type IGBT device that it is difficult to install a current sensor inside it to monitor its operating status. Especially when crimping devices are installed on inverters, power units and other equipment, only the total current can be monitored, and the current of each chip inside cannot be monitored individually to evaluate their working status and service life. [0004] In order to solve the above problems,...
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IPC IPC(8): H01L23/64G01R19/00
CPCG01R19/0092H01L23/645H01L2223/64
Inventor 李金元吴鹏飞李尧圣王鹏崔梅婷
Owner GLOBAL ENERGY INTERCONNECTION RES INST CO LTD