Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chip pressure measurement device

A technology of pressure measurement device and chip, which is applied in the direction of measurement device, mechanical component test, machine/structural component test, etc. It can solve the problems of poor pressure measurement stability, low pressure measurement efficiency and high cost, and achieve pressure measurement stability Good, the effect of improving safety

Inactive Publication Date: 2019-04-09
HANGZHOU CHANGCHUAN TECH CO LTD
View PDF8 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the shortcomings of the current chip detection equipment with single or multiple independently set pressure measuring heads, which have poor pressure measurement stability, low pressure measurement efficiency or high cost, and provide a pressure measurement A chip pressure measuring device with good stability, high pressure measurement efficiency and low cost

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip pressure measurement device
  • Chip pressure measurement device
  • Chip pressure measurement device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] The present invention will be further described below in conjunction with the accompanying drawings.

[0016] as attached figure 1 , attached figure 2 , attached image 3 , attached Figure 4 Shown: a chip pressure measuring device, including: a substrate 1, a number of pressure measuring devices 2; The two ends of the pressure seat 3 pass through the accommodation groove 4, and the guide through hole 5 that is provided on the bottom surface of the accommodation groove 4 and penetrates with the lower end of the pressure measuring seat 3 is penetrated in the guide through hole 5 and fits with the guide through hole 5 The pressure head 6 is located in the accommodation groove 4 and integrally forms a lifting block 7 connected with the upper end of the pressure head 6, and two adjustment screws 8, the number of the upper end of the lifting block 7 is the same as the number of the adjustment screws 8 and one by one Corresponding screw holes 9, the base plate 1 is provi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a chip pressure measurement device. The device comprises a substrate and a plurality of pressure measurement devices, wherein each pressure measurement device comprises a pressure measurement seat connected with the lower end of the substrate, a containing slot arranged at the upper end of the pressure measurement seat and communicated with two ends of the pressure measurement seat, a guiding through hole arranged on the bottom surface of the containing slot and communicated with the lower end of the pressure measurement seat, a pressure head penetrated in the guidingthrough hole and adapted to the guiding through hole, a lifting block arranged in the containing slot and connected with the upper end of the pressure head, at least one adjustment screw, screw holesarranged at the upper end of the lifting block, same as the adjustment screws in the aspect of number and corresponding to the adjustment screws one by one, hang spring through holes formed in the substrate, same as the adjustment screws in the aspect of number and corresponding to the adjustment screws one by one, and a pressure spring group arranged between the upper end of the lifting block andthe lower end of the substrate; the lower end of the adjustment screws pass through the hang spring through holes to be screwed with the screw holes; and the width of the lifting block is adapted tothe width of the containing slot. The chip pressure measurement device is relatively good in pressure measurement stability, relatively high in pressure measurement efficiency and relatively low in cost.

Description

technical field [0001] The invention relates to the field of integrated circuit testing and sorting, in particular to a chip pressure measuring device. Background technique [0002] Integrated circuit chip pressure measurement is an important part of integrated circuit quality inspection, and the performance of the pressure measurement device directly determines the efficiency and stability of integrated circuit pressure measurement. Traditional chip testing equipment has single or multiple independently set pressure measuring heads, which have the disadvantages of poor pressure measurement stability, low pressure measurement efficiency or high cost; therefore, a design with better pressure measurement stability, A chip pressure measurement device with high pressure measurement efficiency and low cost has become an urgent problem to be solved. Contents of the invention [0003] The purpose of the present invention is to overcome the shortcomings of the current chip detect...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01N3/08G01N3/02G01M13/00
CPCG01M13/00G01N3/02G01N3/08G01N2203/0282G01N2203/0441G01N2203/0019
Inventor 冯雨周鲍军其胡冲
Owner HANGZHOU CHANGCHUAN TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products