Nickel colloid catalyst solution for electroless nickel or nickel alloy plating and method for electroless nickel or nickel alloy plating

A technology of electroless nickel plating and nickel alloy, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of inability to electroless nickel plating, etc., achieve good uniformity of appearance, prevent mixing, and excellent stability Effect

Active Publication Date: 2021-04-09
ISHIHARA CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, electroless nickel plating cannot be performed on precious metals such as gold because palladium catalyst nuclei are not replaced and precipitated (paragraph 4)

Method used

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  • Nickel colloid catalyst solution for electroless nickel or nickel alloy plating and method for electroless nickel or nickel alloy plating
  • Nickel colloid catalyst solution for electroless nickel or nickel alloy plating and method for electroless nickel or nickel alloy plating
  • Nickel colloid catalyst solution for electroless nickel or nickel alloy plating and method for electroless nickel or nickel alloy plating

Examples

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Effect test

Embodiment

[0141] Below, the embodiment of the electroless nickel plating or the nickel alloy method including the preparation of the liquid containing the adsorption accelerator of the present invention, the nickel colloid catalyst liquid, and the electroless nickel plating or the nickel alloy liquid is described, and it is explained in sequence: preparation Test example of initial nickel colloidal catalyst solution over time, test example of appearance evaluation of nickel (or nickel alloy) film precipitated by electroless plating using the catalyst solution, test example of repeated use resistance when nickel colloidal catalyst solution is used repeatedly An evaluation test example and an appearance evaluation test example of a nickel (or nickel alloy) film deposited by electroless plating using the repeatedly used catalyst solution.

[0142] It should be noted that the present invention is not limited to the following examples and test examples, and it is of course possible to arbitra...

Embodiment 4-5

[0147] Embodiment 4-5: the example of changing the content of soluble nickel salt (A)

Embodiment 10-12

[0148] Embodiment 10-12: change the example of colloid stabilizer (C)

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Abstract

The invention provides a method for electroless nickel or nickel alloy plating. In the method, a non-conductive substrate is immersed in a liquid containing a surfactant for adsorption promotion treatment, and then the non-conductive substrate is treated with a nickel colloid catalyst solution for electroless nickel plating. Catalyst gives, then carries out electroless nickel plating, wherein the nickel colloidal catalyst solution for electroless nickel plating contains soluble nickel salt (A), reducing agent (B), and by glucose, fructose, sorbitol, xylitol, maltitol, mannitol The colloidal stabilizer (C) of specific carbohydrate composition such as. Catalyst imparting and electroless nickel plating are performed using a nickel colloidal catalyst solution that has excellent stability over time and repeated use resistance after catalyst activity is enhanced by adsorption promotion treatment, so a uniform nickel film without precipitation spots can be obtained. Even if a nickel alloy plating method is used instead of the nickel plating method described above, a nickel alloy film having excellent uniformity can be obtained.

Description

technical field [0001] The present invention relates to a nickel colloid catalyst solution for imparting a catalyst when electroless nickel or nickel alloy plating is performed on a non-conductive substrate, and an electroless plating method using the catalyst solution, which provides excellent stability over time and can form a uniform appearance It is a catalyst solution that has no streaky nickel or nickel alloy film, and can improve the effectiveness of repeated use of the nickel colloid catalyst solution by inserting a predetermined treatment before catalyst application. Background technique [0002] In order to represent resin substrates such as glass-epoxy resin, glass-polyimide resin, epoxy resin, polyimide resin, polycarbonate resin, ABS resin, PET resin, etc., including glass substrates, ceramic substrates, etc. Electroless nickel or nickel alloy plating is carried out on the non-conductive substrate inside. The conventional method is: firstly, metals such as palla...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/18C23C18/34
CPCC23C18/18C23C18/34C23C18/1837C23C18/2073C23C18/50
Inventor 吉泽章央田中雄也内田卫田中薰
Owner ISHIHARA CHEM
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