Nickel colloidal catalyst solution for electroless nickel or nickel alloy plating, and method for electroless nickel or nickel alloy plating

Abstract

In the present invention, a non-conductive substrate is submerged in a liquid containing a surfactant for an adsorption enhancement processing; next, a catalyst is imparted to the non-conductive substrate in a nickel colloidal catalyst solution for electroless nickel plating, the solution containing a colloidal stabilizer (C) comprising a soluble nickel salt (A), a reducing agent (B), and a specific sugar such as glucose, fructose, sorbitol, xylitol, maltitol, or mannitol; and subsequently the electroless nickel plating is performed. After the catalytic activity is enhanced by the adsorption enhancement processing, a catalyst is imparted to the nickel colloidal catalyst solution that is highly stable over time and over repeated uses, and the electroless nickel plating is performed. As a result, a uniform nickel coating without uneven precipitation can be obtained. Even if this nickel plating method is replaced with a nickel alloy plating method, a highly uniform nickel alloy coating can be obtained.

Description

technical field [0001] The present invention relates to a nickel colloid catalyst solution for imparting a catalyst when electroless nickel or nickel alloy plating is performed on a non-conductive substrate, and an electroless plating method using the catalyst solution, which provides excellent stability over time and can form a uniform appearance It is a catalyst solution that has no streaky nickel or nickel alloy film, and can improve the effectiveness of repeated use of the nickel colloid catalyst solution by inserting a predetermined treatment before catalyst application. Background technique [0002] In order to represent resin substrates such as glass-epoxy resin, glass-polyimide resin, epoxy resin, polyimide resin, polycarbonate resin, ABS resin, PET resin, etc., including glass substrates, ceramic substrates, etc. Electroless nickel or nickel alloy plating is carried out on the non-conductive substrate inside. The conventional method is: firstly, metals such as palla...

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Problems solved by technology

However, electroless nickel plating cannot be performed on precious metals such as gold because palladium catalyst nuclei are not replaced and precipitated (paragraph 4)

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