Sensitive circuit layout design method and a layout
A layout design and circuit technology, applied in computing, electrical digital data processing, special data processing applications, etc., can solve problems affecting the performance of sensitive circuits, metal wire crosstalk, etc., to solve the problem of insufficient metal density, avoid interference, and improve performance Effect
Active Publication Date: 2019-04-19
上海航芯电子科技股份有限公司
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Problems solved by technology
[0007] As the size of the process continues to shrink, the stress problem caused by the metal density will become more and more obvious, and it becomes less and less advisable to ignore the lack of metal density. However, using the existing method for sensitive circuits to manually add metal lines will inevitably introduce metal crosstalk between wires, which can affect the performance of sensitive circuits
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[0038] The layout design method and layout of a sensitive circuit provided by the present invention will be described in detail below in conjunction with the accompanying drawings. This embodiment is implemented on the premise of the technical solution of the present invention, and detailed implementation methods and specific operations are given. process, but the scope of protection of the present invention is not limited to the following examples, those skilled in the art can modify and embellish it within the scope of not changing the spirit and content of the present invention.
[0039] In order to make the above objects, features and beneficial effects of the present invention more comprehensible, specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0040] The invention is used to eliminate insufficient metal density while ensuring that the performance of the chip is not affected. For the case whe...
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Abstract
The invention discloses a sensitive circuit layout design method and a sensitive circuit layout, the sensitive circuit layout design method is used for removing insufficient metal density, and comprises the following steps: if the metal density of the sensitive circuit layout does not meet the requirement, introducing a metal line from a bonding pad; Adding a plurality of substrate contacts meeting the requirement of metal density on the periphery and inside of the sensitive circuit layout so as to improve the metal density of the sensitive circuit layout; Meanwhile, the substrate is in contact connection with the metal wires. The method is used for eliminating metal density insufficiency and meanwhile ensuring that the performance of the chip is not affected.
Description
technical field [0001] The invention relates to the field of integrated circuit layout design, in particular to a layout design method and layout of sensitive circuits. Background technique [0002] In the process of chip design, there is a problem of uneven distribution of metal wires. These do not pose a threat in the design, but in the process of chip production, insufficient metal density will cause stress problems. The smaller the size of the process stress, the more obvious it is. In order to avoid stress problems, chip manufacturers will define the metal density of each layer of metal in the design rules. There are requirements for local density and overall density. Now the method for most chips to eliminate the lack of metal density is to use the CALIBRE assembly statement to automatically add metal. DUMMY. [0003] As we all know, sensitive circuits are easy to change their performance due to external interference. Metal DUMMY must not be added casually around and ...
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Login to View More IPC IPC(8): G06F17/50
CPCG06F30/392Y02P70/50
Inventor 高敬周玉洁孙坚
Owner 上海航芯电子科技股份有限公司