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How to make printed circuit boards

A technology for printed circuit boards and circuit boards, which is applied in the directions of printed circuit manufacturing, printed circuits, and the formation of electrical connection of printed components, and can solve problems such as low flatness

Active Publication Date: 2020-07-28
GUANGZHOU FASTPRINT CIRCUIT TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a method for preparing printed circuit boards to solve the problem of low flatness.

Method used

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  • How to make printed circuit boards
  • How to make printed circuit boards
  • How to make printed circuit boards

Examples

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Embodiment Construction

[0025] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0026] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening ele...

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Abstract

The invention relates to a method for preparing a printed circuit board, which comprises the following steps: S100, providing a multilayer circuit board; S200, processing a through hole on the multilayer circuit board, and performing hole plating copper and resin hole plugging treatment on the through hole; S300, baking the multilayer circuit board for the first time, curing and shrinking the resin in the through hole to form a depression, and carrying out the first plate grinding treatment on the multilayer circuit board; S400, covering the resin protective layer on the multilayer circuit board, processing an insert hole, and removing resin and glass fiber on the inner wall of the insert hole; S500, carrying out copper deposition treatment on the inner wall of the insert hole; S600, carrying out electroplating treatment on the concave part to ensure that metal protruding out of the concave part is deposited at the concave part; S700, removing the covering resin protective layer, and carrying out the second plate grinding treatment on the multilayer circuit board. The covered resin protective layer can protect the resin in the through hole from being influenced in the process of removing the resin on the inner wall of the insert hole.

Description

technical field [0001] The invention relates to the technical field of circuit board preparation, in particular to a method for preparing a printed circuit board. Background technique [0002] Some aerospace and military products, due to their application in harsh environments such as extreme heat, extreme cold, and high pressure, have extremely strict requirements on the reliability of electronic components compared with ordinary products, and generally require positive recessed printed circuit boards. [0003] When preparing a positively etched printed circuit board with a via hole, the metal layer at the via hole on the positively etched printed circuit board will be depressed, so that the flatness of the positively etched printed circuit board is low. Contents of the invention [0004] Based on this, it is necessary to provide a method for preparing a printed circuit board to solve the problem of low flatness. [0005] A method for preparing a printed circuit board, c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/42H05K3/00
CPCH05K3/0055H05K3/429H05K2203/1105
Inventor 许龙龙罗畅陈黎阳
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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