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Heat dissipation control method of heat dissipation system for projector

A heat dissipation system and control method technology, applied in the direction of instruments, optics, projection devices, etc., can solve the problems of affecting movie viewing experience, limited heat dissipation space, low heat dissipation efficiency, etc., and achieve the elimination of the influence of fan noise, low noise and high efficiency heat dissipation , the effect of preventing condensation

Inactive Publication Date: 2019-05-28
李丹
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Problems solved by technology

[0002] At present, micro-projectors are favored by more and more people because of their small size and convenience. However, due to the limitation of heat dissipation space, cooling fans are generally used to continuously cool down the heat dissipation of projection chips, which will greatly affect people's viewing experience, because only The sound of the fan can only be masked when the speaker is loud, and the heat dissipation is inefficient

Method used

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  • Heat dissipation control method of heat dissipation system for projector

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Embodiment

[0019] like figure 1 As shown, the heat dissipation system for a projector includes a heat conduction temperature measuring device located at the front end and the middle of the system and a heat dissipation device located at the end of the system; The cold end heat conduction block 2 and the hot end heat conduction block 3 are composed of the cold end heat conduction block and the hot end heat conduction block; The end heat conduction block 3 is provided with a groove for embedding a temperature sensor to accommodate the temperature sensor and lead out its power supply electrodes. A good heat conduction contact is required between the temperature sensor and the heat conduction block where it is located; The end heat conduction block 3 is thermally connected to the cold end heat conduction block 2 of the heat conduction temperature measuring device in the middle of the system through heat conduction tubes; according to different application spaces, different heat conduction tu...

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Abstract

The invention discloses a heat dissipation control method of a heat dissipation system for a projector, and the projector comprises a loudspeaker, and is characterized in that the heat dissipation system comprises heat conduction temperature measurement devices arranged at the front end and the middle part of the system, and a heat dissipation device arranged at the tail end of the system; each heat conduction temperature measurement device is composed of a semiconductor chilling plate (1), a cold end heat conduction block (2) and a hot end heat conduction block (3), wherein the cold end heatconduction block (2) and the hot end heat conduction block (3) are respectively in heat conduction contact with the cold end face and the hot end face of the semiconductor chilling plate (1); temperature sensors are respectively arranged on the cold end heat conduction block (2) and the hot end heat conduction block (3). The control method is high in heat dissipation efficiency, is small in occupied space, is flexible in layout and is good in mute effect.

Description

technical field [0001] The invention relates to the technical field of heat dissipation systems, in particular to a heat dissipation control method for a heat dissipation system for a projector. Background technique [0002] At present, micro-projectors are favored by more and more people because of their small size and convenience. However, due to the limitation of heat dissipation space, cooling fans are generally used to continuously cool down the heat dissipation of projection chips, which will greatly affect people's viewing experience, because only The sound of the fan can only be masked when the speaker is loud, and the heat dissipation is inefficient. Contents of the invention [0003] The technical problem to be solved by the present invention is to overcome the above shortcomings of the prior art: to provide a heat dissipation control method for a projector heat dissipation system with high heat dissipation efficiency, less space occupation, flexible layout and g...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03B21/16
Inventor 李丹
Owner 李丹
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