A method for lossless transfer of self-supporting low-dimensional materials

Abstract

The invention relates to the field of low-dimensional functional material science and material testing and analysis technology research and specifically relates to a method for the accurate positioning, cutting and non-destructive transfer of self-supporting low-dimensional materials for foil, film and two-dimensional materials. Since the majority of self-supporting low-dimensional materials withthe requirement of a transfer operation have the thickness ranges from a few nanometers to a few hundred micrometers, the in-plane dimensions are on the order of millimeters to micrometers, the materials are highly susceptible to damage during sampling and processing process, the proportion is extremely small, and the materials are easily affected by an external environment (such as airflow and static electricity) and is difficult to accurately control and position. The method introduces the technical means of femtosecond laser cutting, microgravity, electrostatic introduction and microscopicpositioning, the above problem can be effectively solved, especially for the need to transfer the materials to tiny fragile devices, the method can be applied perfectly, and the research and application of self-supporting low-dimensional functional materials are expanded greatly.

Description

technical field [0001] The invention relates to the research fields of low-dimensional functional material science and material testing and analysis technology, specifically a method for precise positioning, cutting, and non-destructive transfer of self-supporting low-dimensional materials for foils, films, and two-dimensional materials. Especially when transferring to fragile tiny target carriers, its unique advantages can be fully demonstrated. Background technique [0002] Commonly used low-dimensional materials, such as: foils, functional films, two-dimensional materials, etc., due to their unique spatial structure and electrical and thermal properties, the research and application of low-dimensional materials have developed rapidly in recent years, in the field of microelectronics, It has broad application prospects in the field of biological detection and batteries. When transferring self-supporting low-dimensional materials to tiny fragile chips for testing and resea...

AI Technical Summary

Problems solved by technology

However, the instruments used in this method are very expensive, and the steps are extremely cumbersome. The electrode chip carrier is often only a few hundred nanometers, which is very fragile and easy to damage, and requires strong professionalism. Moreover, because it is transferred first and then etched, during the etching process, Some samples are easily damaged and not universal. At the same time, the electrode pattern and shape are also limited and cannot be too complicated, so there are obvious defects in the exploration of its performance.

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