Test nest for chip test, test jig and method

Abstract

The invention discloses a test nest for chip test, a test jig and a method. The test nest comprises a nest upper plate, and a nest lower plate; a chip slot for holding a tested chip is arranged on anupper surface of the nest upper plate, a bulge part is arranged on a lower surface of the nest upper plate, and the surface impedance of the nest upper plate is 1*10(7) omega to 9.9*10(8) omega; a sunken part is arranged on the upper surface of the nest lower plate, the bulge part is embedded into the sunken part, and the surface impedance of the nest lower plate is not less than 1*10(12) omega; multiple probe through holes penetrating through the nest upper plate and the nest lower plate are distributed in the chip slot. A double-deck test nest is formed through the nest upper plate and the nest lower plate; the electrostatic can be effectively prevented through the nest upper plate, and the nest lower plate can play an insulation effect on the probes; the service life of the whole test nest can be improved through the nest lower plate; the nest upper plate does not contact with the test probes, thereby preventing the short-circuiting between the test probes caused by the nest upper plate.

Description

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AI Technical Summary

Benefits of technology

This technology helps create an improved testing environment for electronic devices with probes attached thereto. By adding two layers between the top layer and bottom layer of the device's housing or case, it prevents any electrical charge on both components during use without affecting their performance. Additionally, this design improves overall durability over existing designs while still maintaining good signal quality.

Problems solved by technology

This technical problem addressed in this patents relates to improving the durability or lifespan of chips used for testing during manufacturing processes due to their potential damage caused when they are dropped onto them while still being able to perform various tests without losing any coatings that could protect against electrostatics.

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