A method and device for detecting aggregation of defect points

A defect point and aggregation technology, applied in image data processing, instruments, calculations, etc., can solve the problems of inability to guarantee the accuracy of test results, inconsistent test standards, poor accuracy, etc.

Active Publication Date: 2019-06-14
BOE TECH GRP CO LTD +1
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  • Abstract
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  • Claims
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Problems solved by technology

[0004] In the process of realizing the present invention, the inventor found the following technical problems in the prior art. Because the number of defect point maps that need to be detected is too large, when the staff detects all the defect point maps, it must be It takes a lot of ti

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  • A method and device for detecting aggregation of defect points
  • A method and device for detecting aggregation of defect points
  • A method and device for detecting aggregation of defect points

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Embodiment Construction

[0063] Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0064] An embodiment of the present invention provides a method for detecting the aggregation of defect points, such as figure 1 As shown, the method includes:

[0065] 101. Obtain the defect point map to be detected, the partition mode, the number of partitions, and the variance threshold.

[0066] Among them, the defect point map to be detected is the defect point map corresponding to the array substrate to be detected. During the AOI detect...

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Abstract

The invention discloses a method and a device for detecting aggregation of defect points, relates to the technical field of automatic optical detection, improves the detection efficiency and accuracyof detecting whether the defect points in a defect point graph have aggregation, and adopts the main technical scheme that obtaining a to-be-detected defect point graph, a partition mode, the number of partitions and a variance threshold value are obtained; carrying out region segmentation processing on the defect point graph to be detected according to the partitioning mode and the partitioning number so as to obtain a plurality of partitions; determining the number of defect points corresponding to each partition, and calculating a normalized proportion value corresponding to each partitionaccording to the number of defect points corresponding to each partition; calculating variance values corresponding to the plurality of normalized proportion values; judging whether the variance valueis greater than the variance threshold or not; and if yes, determining that the defect points in the to-be-detected defect point graph have aggregation. The method is applied to the process of detecting whether the defect points in the defect point graph have aggregation or not.

Description

technical field [0001] The invention relates to the technical field of automatic optical detection, in particular to a method and device for detecting the concentration of defect points. Background technique [0002] With the continuous development of science and technology, AOI (Automatic Optical Inspection) technology has been widely used in the electronics manufacturing industry. In the manufacturing process of the array substrate, it is very important to detect whether the defect points on the array substrate are aggregated. During the AOI inspection process of the AOI inspection equipment on the array substrate, the AOI inspection equipment will record the coordinates of each defect point on the array substrate according to the preset coordinate system, and after the inspection is completed, according to each defect point recorded The corresponding coordinates are used to draw a defect point map corresponding to the array substrate, and according to the defect point ma...

Claims

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Application Information

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IPC IPC(8): G06T7/00G06T7/11
Inventor 杨姗姗胡龙敢冯玉春
Owner BOE TECH GRP CO LTD
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