A logistics status monitoring method and system based on multi-sensor fusion

Abstract

The invention discloses a logistics state monitoring method and system based on multi-sensor fusion. The system includes several smart labels, and each smart label is composed of a label shell, a microcontroller, a sensor module, a wireless communication module and a power supply module; the label shell Installed on the surface of the transported goods; the microcontroller is responsible for the task scheduling of the entire system; the sensor module is interconnected through multiple types of sensors to realize sensor data collection and event modeling calculations in the cargo transport environment, including vibration, impact, dumping, falling, demolition Sealing, temperature and humidity imbalance and other events; the wireless communication module sends sensor data, time stamps and event records to the monitoring mobile terminal or remote cloud server; the present invention can effectively monitor the real-time status and events of goods during the delivery of production materials and logistics transportation Record information, and timely alarm when the goods are damaged, so as to accurately and effectively monitor the safe transportation of sensitive products.

Description

technical field [0001] The invention belongs to the technical field of logistics, and in particular relates to a method and system for monitoring logistics status based on multi-sensor fusion. Background technique [0002] In the logistics process, large and valuable goods may be damaged due to factors such as dumping and collision during loading and unloading, and bumps and vibrations during transportation. At present, most of the existing anti-collision and anti-shock label products are realized in a non-intelligent way based on physical detection. The transport personnel cannot obtain the abnormal transportation status of the goods in real time, and cannot determine the responsible person in time when the goods are damaged. At the same time, the maturity and development of semiconductor technology has also reduced the cost of electronic sensors, making sensors more and more widely used. Contents of the invention [0003] The object of the present invention is to provid...

AI Technical Summary

Problems solved by technology

At present, most of the existing anti-collision and anti-shock label products are realized in a non-intelligent way based on physical detection. The transportation personnel cannot obtain the abnormal transportation status of the goods in real time, and cannot determine the responsible person in time when the goods are damaged.

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