Logistics state monitoring method and system based on combination of sensors

A technology of multi-sensor fusion and logistics status, applied in the field of logistics, can solve problems such as the inability to obtain the abnormal transportation status of the goods in real time, and the inability to determine the responsible person of the goods in time, so as to achieve the effect of monitoring safe transportation and improving transportation efficiency.

Active Publication Date: 2019-06-28
ZHEJIANG UNIV
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most of the existing anti-collision and anti-shock label products are realized in a non-intelligent way based on physical detection. The transportation personnel cannot obtain the abnormal transportation status of the goods in real time, and cannot determine the responsible person in time when the goods are damaged.

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  • Logistics state monitoring method and system based on combination of sensors
  • Logistics state monitoring method and system based on combination of sensors

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Embodiment Construction

[0032] The specific embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0033] Such as figure 1 As shown, a kind of logistics status monitoring system based on multi-sensor fusion provided by the present invention, it is made up of label housing 5, low-power microcontroller MCU1, wireless communication module 3, sensor module 4, and power supply module 2; The label shell 5 is the carrier of the carrier of the electronic device, which is a detachable label black box, which can be installed inside the logistics packaging box or on the surface of the goods; the microcontroller MCU1 is connected with the sensor module 4 and the wireless communication module 3, responsible for the entire The task scheduling of the system includes data acquisition control, sensor data recording and transmission, event judgment, etc.; the sensor module 4 is connected to the MCU1 to detect the transportation environment of the...

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Abstract

The invention discloses a logistics state monitoring method and system based on combination of sensors. The system comprises intelligent labels, each intelligent label is composed of a label casing, amicrocontroller, a sensor module, a wireless communication module and a power supply module, the label casing is mounted in the surface of a transport cargo, the microcontroller is responsible for work task scheduling of the whole system, via interconnection of different types of sensors, the sensor module can realize sensor data collection and event modeling calculation in the cargo transport environment, events include shocking, collision, overturning, falling off, unsealing and temperature and humidity imbalance, and the wireless communication module sends the sensor data, time label and event record to a monitoring mobile terminal or remote cloud server. Thus, real-time state and event record information of cargoes in the production material transmission and logistics transport process can be monitored effectively, alarm is raises against damage of cargoes timely, and safe transport of sensitive products can be monitored accurately and effectively.

Description

technical field [0001] The invention belongs to the technical field of logistics, and in particular relates to a method and system for monitoring logistics status based on multi-sensor fusion. Background technique [0002] In the logistics process, large and valuable goods may be damaged due to factors such as dumping and collision during loading and unloading, and bumps and vibrations during transportation. At present, most of the existing anti-collision and anti-shock label products are realized in a non-intelligent way based on physical detection. The transport personnel cannot obtain the abnormal transportation status of the goods in real time, and cannot determine the responsible person in time when the goods are damaged. At the same time, the maturity and development of semiconductor technology has also reduced the cost of electronic sensors, making sensors more and more widely used. Contents of the invention [0003] The object of the present invention is to provid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05B19/042G01D21/02
Inventor 黄文君陈梦迟高鹏飞
Owner ZHEJIANG UNIV
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