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A kind of tin ball nozzle and its preparation method

A nozzle and solder ball technology, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, circuits, etc., can solve problems such as low efficiency, troublesome manual shredding, uneven film thickness on the inner surface of the solder ball nozzle, etc., and improve the service life , to ensure the accuracy of the aperture and to improve the uniformity

Active Publication Date: 2021-02-26
河南明华智能系统研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In 2005, Liu Haixia prepared BGA solder balls with uniform particles by shredding and remelting. However, this method has the disadvantages of manual shredding and low efficiency.
[0004] There are many ways to prepare diamond, such as hot pressing sintering, physical vapor deposition (PVD) coating, enhanced chemical vapor deposition (PECVD) chemical vapor deposition, etc., but for the coating of the inner hole, these methods will produce the thickness of the film layer on the inner surface of the solder ball nozzle. uneven defect

Method used

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  • A kind of tin ball nozzle and its preparation method
  • A kind of tin ball nozzle and its preparation method
  • A kind of tin ball nozzle and its preparation method

Examples

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preparation example Construction

[0027] For the preparation method of the above-mentioned tin ball nozzle, the specific steps are as follows:

[0028] 1) Hot pressing main body: Nozzle base 1 is prepared by hot forging hydraulic method;

[0029] 2) Laser drilling: The solder ball nozzle 3 is prepared by laser drilling;

[0030] 3) Cleaning: Ultrasonic cleaning of the matrix obtained in step 2 in acetone, and drying;

[0031] 4) Coating: Coating a diamond film layer 2 on the inner surface of the dried substrate to obtain a tin ball nozzle.

[0032] Step 3) After the matrix is ​​ultrasonically cleaned in acetone for 5-10min, use N 2 Dry with air to remove organic matter on the inner surface and increase the bonding force of the diamond film.

[0033] In step 4), the diamond film layer 2 is plated by a hot wire chemical vapor deposition method.

[0034] The process parameters of the hot wire chemical vapor deposition method are as follows: CH 4 -H 2 Mixed gas flow 200-500sccm, CH 4 Accounting for 1-1.5% o...

Embodiment 1

[0042] A solder ball nozzle, comprising a nozzle base 1, the nozzle base 1 is composed of a neck section 101, a funnel section 102 and a flat bottom end 103, the inner wall of the nozzle base 1 is coated with a diamond film 2, and the flat bottom end 103 of the nozzle base 1 is provided with a solder ball The nozzle 3; the neck section 101 is cylindrical, and the funnel section 102 is cone-shaped.

[0043] The nozzle base 1 is made of Ti alloy.

[0044] The inner diameter of the neck section 101 is 5mm, the wall thickness is 2mm, and the height is 3mm. The outer surface of the neck section 101 is provided with threads; The thickness of the solder ball nozzle 3 is 0.5 mm, and the diameter of the solder ball nozzle 3 is 0.2 mm. The diameter of the solder ball nozzle 3 is determined according to the diameter of the solder ball required.

[0045] The thickness of the diamond film layer 2 is 10 μm.

[0046] For the preparation method of the above-mentioned tin ball nozzle, the sp...

Embodiment 2

[0052] A solder ball nozzle, comprising a nozzle base 1, the nozzle base 1 is composed of a neck section 101, a funnel section 102 and a flat bottom end 103, the inner wall of the nozzle base 1 is coated with a diamond film 2, and the flat bottom end 103 of the nozzle base 1 is provided with a solder ball The nozzle 3; the neck section 101 is cylindrical, and the funnel section 102 is cone-shaped.

[0053] The nozzle base 1 is made of Ti alloy.

[0054] The inner diameter of the neck section 101 is 5mm, the wall thickness is 2mm, and the height is 3mm. The outer surface of the neck section 101 is provided with threads; The thickness of 103 is 0.5 mm, the diameter of the solder ball nozzle 3 is 0.5 mm, and the diameter of the solder ball nozzle 3 is determined according to the diameter of the solder ball required.

[0055] The thickness of the diamond film layer 2 is 12 μm.

[0056] For the preparation method of the above-mentioned tin ball nozzle, the specific steps are as f...

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Abstract

The invention discloses a solder ball nozzle, which comprises a nozzle base body. The nozzle base body is composed of a neck section, a funnel section and a flat bottom end. The inner wall of the nozzle base body is coated with a diamond film layer. The flat bottom end of the nozzle base body is provided with a solder ball nozzle; the neck section is Cylindrical, the funnel section is cone-shaped. The invention adopts the laser as the processing method, which ensures the accuracy of the aperture of the outlet of the nozzle. The invention is prepared by means of hot wire chemical vapor deposition, which improves the uniformity of the diamond film layer on the inner wall of the nozzle nozzle from the neck section and the funnel end of the nozzle body. The nozzle of the invention improves the true circle of BGA solder balls from 95% to 96%. The inner surface of the nozzle of the present invention is coated with diamond, and the diamond is resistant to high temperature and wear-resisting, so that the service life of the nozzle can be doubled.

Description

technical field [0001] The invention belongs to the technical field of new materials, and in particular relates to a tin ball nozzle and a preparation method thereof. Background technique [0002] BGA (Ball Grid Array) solder balls are a series of tin-based alloy solder balls with a diameter ranging from 0.2 to 0.8mm. They are mainly used for chip packaging, connecting the I / O terminals of the circuit and the printed circuit board (PCB), and its quality affects chip packaging level. This puts forward quite high requirements on the uniformity and shape precision of solder balls. In 2005, Liu Haixia prepared BGA solder balls with uniform particles by shredding and remelting. However, this method has the disadvantages of manual shredding and low efficiency. At the end of the 20th century, Dr. Chun from the Massachusetts Institute of Technology studied the uniform fracture process of metal jets. On the basis of this principle, he prepared a vibration-spraying solder ball prepa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48
CPCH01L21/4814
Inventor 王云飞张黎燕高志廷尹长青唐坤
Owner 河南明华智能系统研究院有限公司