Circuit board and formation method of circuit board, and camera module

A technology of camera modules and circuit boards, applied in the direction of cameras, printed circuits, printed circuits, etc., can solve the problems of power increase, affecting the service life of mobile phone cameras, unstable picture quality, etc., and achieve the effect of avoiding imaging quality

Inactive Publication Date: 2019-08-16
TRIPLE WIN TECHSHENZHEN CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, with the gradual increase in the performance of the camera module, the power it uses is also increasing. During long-term operation, the power-on device will continue to generate heat, and the picture quality of the mobile phone camera working under high temperature is unstable. It will affect the service life of the mobile phone camera

Method used

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  • Circuit board and formation method of circuit board, and camera module
  • Circuit board and formation method of circuit board, and camera module
  • Circuit board and formation method of circuit board, and camera module

Examples

Experimental program
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Embodiment Construction

[0034] The present invention will be further described in detail below in conjunction with the accompanying drawings.

[0035] see Figure 1-4 , a camera module 1 provided in the first embodiment of the present invention. figure 1 The auto-focus dual-lens module is used as an example for illustration, and it can be understood that the technical solution of the present invention can also be used for a fixed-focus module and an auto-focus single-lens module.

[0036] The camera module 1 includes a circuit board 20, an image sensor 30 electrically connected to the circuit board 20, a base 40 disposed on the circuit board 20, and a base 40 disposed on the base. The lens holder 50 , the lens module 60 and the upper cover bracket 70 accommodated in the lens holder 50 .

[0037] see figure 2 and image 3 , the circuit board 20 includes a wiring area 101 and a heat dissipation area 103 inside the wiring area 101 . In this embodiment, the wiring area 101 is electrically insulated...

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Abstract

The invention provides a camera module. The camera module comprises a circuit board, an image sensor electrically connected with and arranged on the circuit board, a lens base arranged on the circuitboard, and a lens module held in the lens base, the circuit board comprises a wiring region and a heat dissipation region located at the inner side of the wiring region, the wiring region is electrically insulated from the heat dissipation region, the wiring region is provided with a conductive circuit configured to electrically connect with the image sensor, the heat dissipation region is provided with a through hole, the through hole is filled with heat conduction materials, the image sensor is arranged at the heat dissipation region, and the heat generated in the image sensor can be dissipated through the heat conduction materials.

Description

technical field [0001] The invention relates to a circuit board, a forming method comprising the circuit board and a camera module comprising the circuit board. Background technique [0002] With the multi-functional development of electronic products, camera modules are widely used in consumer electronic products such as mobile phones, notebook computers, and personal digital assistants. While pursuing multi-functionality, people also hope that electronic products have excellent image effects, that is, they hope that camera modules have high image quality. [0003] However, with the gradual increase in the performance of the camera module, the power it uses is also increasing. During long-term operation, the power-on device will continue to generate heat, and the picture quality of the mobile phone camera working under high temperature is unstable. It will affect the service life of the mobile phone camera. Therefore, it is necessary to provide an imaging device that can ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H04N5/225G03B17/55G03B30/00
CPCH05K1/0206H05K1/0209G03B17/55H04N23/50H04N23/54H04N23/57H04N23/55H05K2201/09972H05K2201/10151H05K2201/10121H04N23/52H04N23/45H05K1/0274H05K1/181
Inventor 李静伟陈信文李昆丁盛杰
Owner TRIPLE WIN TECHSHENZHEN CO LTD
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