Supercharge Your Innovation With Domain-Expert AI Agents!

Epoxy resin composition suitable for flat bump package and production method thereof

A planar bump type, epoxy resin technology, applied in the direction of epoxy resin glue, aldehyde/ketone condensation polymer adhesive, adhesive type, etc., can solve the problems affecting chemical cap opening, Tg high water absorption rate, etc. , to meet the requirements of cap opening and reliability, low water absorption and moderate Tg

Active Publication Date: 2019-08-30
JIANGSU HHCK NEW MATERIAL CO LTD
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Warpage control: generally increase Tg to control warpage, but if Tg is too high, the water absorption rate will be high, and it will affect the chemical cap opening

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Epoxy resin composition suitable for flat bump package and production method thereof
  • Epoxy resin composition suitable for flat bump package and production method thereof
  • Epoxy resin composition suitable for flat bump package and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Embodiment 1, an epoxy resin composition suitable for planar bump packaging, the composition mainly includes epoxy resin, phenolic resin, spherical silica powder, wetting and dispersing agent and other additives,

[0023] Described epoxy resin is a kind of in the epoxy resin represented by formula [1] and formula [2], and its content is 3% of composition gross mass, and described phenolic resin is formula [3] and formula One of the phenolic resins represented by [4], the content of which is 2% of the total mass of the composition;

[0024] Spherical silicon powder is silicon powder with a maximum particle size of 75um and silicon powder with a maximum particle size of 5um. Silicon powder with a maximum particle size of 5um accounts for 15% of the total mass of spherical silicon powder, and silicon powder with a maximum particle size of 75um occupies spherical 85% of the total mass of microsilica powder, and the content of spherical microsilica powder is 92% of the total...

Embodiment 2

[0027] Embodiment 2, an epoxy resin composition suitable for planar bump packaging, the composition mainly includes epoxy resin, phenolic resin, spherical silica powder, wetting and dispersing agent and other additives,

[0028] Described epoxy resin is a kind of epoxy resin represented by formula [1] and formula [2], and its content is 10% of composition gross mass, and described phenolic resin is formula [3] and formula [ 4] a kind of phenolic resin represented, its content is 3% of composition gross mass;

[0029] Spherical silica powder contains silica powder with a maximum particle size of 75um and 20um. The silica powder with a maximum particle size of 20um accounts for 19% of the total mass of spherical silica powder, and the maximum particle size of 75um accounts for 81% of the total mass of spherical silica powder. %, the content of spherical silica powder is 86% of the total content of the composition;

[0030] The wetting and dispersing agent is a polar long-chain ...

Embodiment 3

[0032] Embodiment 3, an epoxy resin composition suitable for planar bump packaging, the composition mainly includes epoxy resin, phenolic resin, spherical silica powder, wetting and dispersing agent and other additives,

[0033] Described epoxy resin is the mixture that is formed by the epoxy resin represented by formula [1] and formula [2], and its content is 5% of composition gross mass, and described phenolic resin is formula [3] and formula [ 4] represents the mixture of phenolic resins, the content of which is 3% of the total mass of the composition;

[0034] Spherical silicon powder is a mixture of silicon powders with a maximum particle size of 75um, 20um and 5um. Silicon powder with a maximum particle size of 5um, silicon powder with a maximum particle size of 20μm, and silicon powder with a maximum particle size of 75um account for 7% of the total content of spherical silicon powder. %, 17% and 76%, the content of spherical silica powder is 89% of the total content of...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an epoxy resin composition suitable for flat bump package and a production method thereof. The composition mainly comprises epoxy resin, phenolic resin, spherical silica powder, a wetting dispersant and another additive, wherein the epoxy resin is one or two of epoxy resin as shown in a formula [1] and a formula [2], the content of the epoxy resin is 3%-10% of the total mass of the composition, the phenolic resin is one or two of phenolic resin as shown in a formula [3] and a formula [4], the content of the phenolic resin is 2%-8% of the total mass of the composition, and the content of the spherical silica powder is 86%-92% of the total content of the composition; the content of the wetting dispersant is 0.1-2% of the total content of the composition; and the content of the additive is 0.5-5% of the total content of the composition. The epoxy resin composition meets the requirements of flat bump package on the aspects of warping, air holes, wire sweep and the like, meanwhile, Tg is moderate, the water absorption is low, and the requirements of the other aspects of decapsulation, the reliability and the like are met.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to an epoxy resin composition suitable for planar bump packaging and a preparation method thereof. Background technique [0002] For decades, integrated circuit packaging technology has been following the development of integrated circuits, and people have been looking for the best balance between small size and high performance. From DIP plug-in packaging to SOP surface mount packaging, and then to QFP flat surface mount packaging, the packaging volume of chips has been developing towards miniaturization, and the structural performance has also been continuously improved. In the 1990s, the QFN four-sided flat package without feet was based on the QFP to place the output corners around the original package body on the bottom of the package body, thereby greatly reducing the space occupied during the placement operation. However, QFN often has problems such as unstable inner corner sold...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J161/06C09J11/04C09J11/06
CPCC09J163/00C09J11/04C09J11/06C08L61/06C08K7/18C08K5/10
Inventor 段杨杨谭伟李兰侠成兴明刘红杰范丹丹
Owner JIANGSU HHCK NEW MATERIAL CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com