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Epoxy resin composition suitable for planar bump packaging and preparation method thereof

A planar bump type, epoxy resin technology, applied in the direction of epoxy resin glue, aldehyde/ketone condensation polymer adhesive, adhesive type, etc., can solve the problems affecting chemical cap opening, Tg high water absorption rate, etc. , to meet the requirements of cap opening and reliability, low water absorption and moderate Tg

Active Publication Date: 2021-12-14
JIANGSU HHCK NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Warpage control: generally increase Tg to control warpage, but if Tg is too high, the water absorption rate will be high, and it will affect the chemical cap opening

Method used

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  • Epoxy resin composition suitable for planar bump packaging and preparation method thereof
  • Epoxy resin composition suitable for planar bump packaging and preparation method thereof
  • Epoxy resin composition suitable for planar bump packaging and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Embodiment 1, an epoxy resin composition suitable for planar bump packaging, the composition mainly includes epoxy resin, phenolic resin, spherical silica powder, wetting and dispersing agent and other additives,

[0023] Described epoxy resin is a kind of in the epoxy resin represented by formula [1] and formula [2], and its content is 3% of composition gross mass, and described phenolic resin is formula [3] and formula One of the phenolic resins represented by [4], the content of which is 2% of the total mass of the composition;

[0024] Spherical silicon powder is silicon powder with a maximum particle size of 75um and silicon powder with a maximum particle size of 5um. Silicon powder with a maximum particle size of 5um accounts for 15% of the total mass of spherical silicon powder, and silicon powder with a maximum particle size of 75um occupies spherical 85% of the total mass of microsilica powder, and the content of spherical microsilica powder is 92% of the total...

Embodiment 2

[0027] Embodiment 2, an epoxy resin composition suitable for planar bump packaging, the composition mainly includes epoxy resin, phenolic resin, spherical silica powder, wetting and dispersing agent and other additives,

[0028] Described epoxy resin is a kind of epoxy resin represented by formula [1] and formula [2], and its content is 10% of composition gross mass, and described phenolic resin is formula [3] and formula [ 4] a kind of phenolic resin represented, its content is 3% of composition gross mass;

[0029] Spherical silica powder contains silica powder with a maximum particle size of 75um and 20um. The silica powder with a maximum particle size of 20um accounts for 19% of the total mass of spherical silica powder, and the maximum particle size of 75um accounts for 81% of the total mass of spherical silica powder. %, the content of spherical silica powder is 86% of the total content of the composition;

[0030] The wetting and dispersing agent is a polar long-chain ...

Embodiment 3

[0032] Embodiment 3, an epoxy resin composition suitable for planar bump packaging, the composition mainly includes epoxy resin, phenolic resin, spherical silica powder, wetting and dispersing agent and other additives,

[0033] Described epoxy resin is the mixture that is formed by the epoxy resin represented by formula [1] and formula [2], and its content is 5% of composition gross mass, and described phenolic resin is formula [3] and formula [ 4] represents the mixture of phenolic resins, the content of which is 3% of the total mass of the composition;

[0034] Spherical silicon powder is a mixture of silicon powders with a maximum particle size of 75um, 20um and 5um. Silicon powder with a maximum particle size of 5um, silicon powder with a maximum particle size of 20μm, and silicon powder with a maximum particle size of 75um account for 7% of the total content of spherical silicon powder. %, 17% and 76%, the content of spherical silica powder is 89% of the total content of...

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Abstract

An epoxy resin composition suitable for planar bump packaging and a preparation method thereof, the composition mainly includes epoxy resin, phenolic resin, spherical silicon micropowder, wetting and dispersing agent and other additives, and the epoxy resin is of the formula [ 1] one or both of the epoxy resins represented by formula [2], the content of which is 3% to 10% of the total mass of the composition, and the phenolic resin is the epoxy resin represented by formula [3] and formula [4] One or two of the resins, the content of which is 2% to 8% of the total composition, the content of spherical silica powder is 86-92% of the total composition; the content of wetting and dispersing agent is the total composition The content of other additives is 0.5-5% of the total content of the composition. The epoxy resin composition meets the requirements of planar bump packaging in terms of warpage, air holes, wire punching, etc., and at the same time has moderate Tg, low water absorption, and meets the requirements of other aspects such as cap opening and reliability.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to an epoxy resin composition suitable for planar bump packaging and a preparation method thereof. Background technique [0002] For decades, integrated circuit packaging technology has been following the development of integrated circuits, and people have been looking for the best balance between small size and high performance. From DIP plug-in packaging to SOP surface mount packaging, and then to QFP flat surface mount packaging, the packaging volume of chips has been developing towards miniaturization, and the structural performance has also been continuously improved. In the 1990s, the QFN four-sided flat package without feet was based on the QFP to place the output corners around the original package body on the bottom of the package body, thereby greatly reducing the space occupied during the placement operation. However, QFN often has problems such as unstable inner corner sold...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J161/06C09J11/04C09J11/06
CPCC09J163/00C09J11/04C09J11/06C08L61/06C08K7/18C08K5/10
Inventor 段杨杨谭伟李兰侠成兴明刘红杰范丹丹
Owner JIANGSU HHCK NEW MATERIAL CO LTD
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