Circuit board lamination method and prefabricated substrate
A technology for circuit boards and substrates, which is applied in the field of circuit board pressing methods and prefabricated substrates, can solve problems such as abnormal impedance, unsuitable actual pressure, thin board edge thickness, etc., to improve the difference in board thickness, avoid resin flow, The effect of improving uniformity
Active Publication Date: 2019-09-10
SHENNAN CIRCUITS
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Problems solved by technology
[0002] Prepregs are used in the processing of multilayer circuit boards, but in lamination processing, the prepregs exhibit a certain modulus and a certain fluidity, and at the same time, the pressure is not very uniform during the processing process, resulting in the thickness of the board edge. Thin inside
The difference in thickness will cause the circuit board to fail to meet the welding requirements, and the abnormal impedance will cause signal transmission problems, etc.
[0003] At present, the method to solve the uneven thickness of the circuit board is generally to increase the elastic buffer material or increase the steel plate, which may not match the actual pressure on the circuit board, and even aggravate the problem of uneven thickness. Therefore, the obtained circuit board The board thickness uniformity effect is not good
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[0045] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0046] The main solution of the embodiment of the present invention is to provide a circuit board pressing method, the method includes: providing two metal substrates, several core boards, several prepregs and prepregs; The prepreg and the prepreg are stacked in a predetermined order to form a prefabricated substrate, wherein the prepreg is arranged along the edge of the prefabricated substrate; and the prefabricated substrate is pressed together.
[0047] Because in the prior art, the use of non-plastic buffer material or steel plate is ineffective in solving the problem of uneven thickness of the circuit board.
[0048] The present invention provides the above solutions, aiming at improving the uniformity of the board thickness of the circuit board.
[0049] An embodiment of the present invention provides a prefabr...
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The invention discloses a circuit board lamination method. The circuit board lamination method comprises the steps of providing two metal substrates, a plurality of core plates, a plurality of prepregs and a semi-solidified material; stacking the metal substrates, the core plates, the prepregs and the semi-solidified material in a preset sequence to form a prefabricated substrate, wherein the semi-solidified material is arranged along the edge of the prefabricated substrate; and laminating the prefabricated substrate. In addition, the invention provides the prefabricated substrate. The methodaims to improve the uniformity of the thickness of a circuit board.
Description
technical field [0001] The invention relates to the technical field of electronic manufacturing, in particular to a circuit board pressing method and a prefabricated substrate Background technique [0002] Prepregs are used in the processing of multilayer circuit boards, but in lamination processing, the prepregs exhibit a certain modulus and a certain fluidity, and at the same time, the pressure is not very uniform during the processing process, resulting in the thickness of the board edge. Thin inside. The difference in thickness will cause the circuit board to fail to meet the welding requirements, and there will be abnormal impedance, which will cause signal transmission problems, etc. [0003] At present, the method to solve the uneven thickness of the circuit board is generally to increase the elastic buffer material or increase the steel plate, which may not match the actual pressure on the circuit board, and even aggravate the problem of uneven thickness. Therefore,...
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IPC IPC(8): H05K3/46
CPCH05K3/4611H05K3/4641
Inventor 刘诗涛李智韩雪川崔荣
Owner SHENNAN CIRCUITS