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Batch BGA (Ball Grid Array) chip ball mounting device and method

A chip and batch technology, applied in the field of batch BGA chip ball planting device, can solve the problems of low efficiency, inconvenient use, unfavorable batch production, etc., and achieve the effect of convenient use and high efficiency

Pending Publication Date: 2019-09-24
深圳市金新福电子技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, in production, the surface of the chip is usually manually planted balls, which is inefficient, inconvenient to use, and not conducive to mass production

Method used

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  • Batch BGA (Ball Grid Array) chip ball mounting device and method
  • Batch BGA (Ball Grid Array) chip ball mounting device and method
  • Batch BGA (Ball Grid Array) chip ball mounting device and method

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Experimental program
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Embodiment Construction

[0028] The present invention will be further described below in conjunction with the accompanying drawings.

[0029] as attached Figure 1-3 The batch BGA chip ball planting device shown includes: a seat body 1, a chip tray 2, an upper cover 3, a stainless steel mesh 4, and a frame body 5; the chip tray 2 has a chip positioning structure, and the chip tray 2 can be positioned relative to the The base body 1 is positioned and fixed and disassembled; the stainless steel mesh 4 is installed on the upper cover 3 , and the upper cover 3 can be positioned, fixed and disassembled relative to the base body 1 . The seat body 1 is installed on the frame body 5 and can be fixed and swing relative to the frame body 5 .

[0030] as attached Figure 4 As shown, the chip tray 2 is formed with a plurality of chip positioning grooves 2-1 arranged in an array, and the chip positioning groove 2-1 is in a square shape as a whole. There is a relief slot 2-11, so that manual or mechanical hands ...

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PUM

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Abstract

The invention discloses a batch BGA (Ball Grid Array) chip ball mounting device and method. The device comprises a base body, a chip tray, an upper cover and a stainless steel net, wherein the chip tray is provided with a chip positioning structure, and the chip tray can be positioned, fixed and disassembled relative to the base body; and the stainless steel net is installed on the upper cover, and the upper cover can be positioned, fixed and disassembled relative to the base body. According to the batch BGA chip ball mounting device and method, the stainless steel net can be positioned and fixed relative to the chip tray conveniently through setting the base body, the chip tray and the upper cover with the stainless steel net, and BGA chips on the chip tray can be mounted in batches through pouring solar balls into the upper cover and shaking the base body, so that the efficiency is high, and the use is convenient.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a batch BGA chip ball planting device and a chip ball planting method. Background technique [0002] In order to improve chip integration, most current IC products are packaged in BGA. The full name of BGA is Ball Grid Array (Ball Grid Array Package), which is widely used in the field of chip packaging due to its advantages such as small package area, large number of pins, and good electrical performance. At present, in production, the chip surface is usually manually planted with balls, which is inefficient, inconvenient to use, and not conducive to mass production. Contents of the invention [0003] Purpose of the invention: In order to overcome the deficiencies in the prior art, the present invention provides a batch BGA chip ball planting device and ball planting method that can batch BGA chips and are easy to use. [0004] Technical solution: In order to achieve t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60
CPCH01L24/742H01L24/11H01L2224/742H01L2224/1112
Inventor 卢志高
Owner 深圳市金新福电子技术有限公司
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