Wafer desorption method, device and semiconductor processing equipment

Abstract

The invention discloses a wafer desorption method, device and semiconductor processing equipment. The method for detaching the wafer includes: S110. The servo controller obtains a preset safe torque value; S120. The servo controller controls the servo motor to drive the thimble mechanism to move to desorb the wafer, and obtains the torque value during the driving process of the servo motor. The maximum torque value; S130, the servo controller judges whether the maximum torque value is not greater than the preset safety torque value, if yes, execute step S140, otherwise no sticky chip occurs, and complete wafer detachment; S140, servo control controller controls the servo motor holding brake. Utilize the method for wafer detachment of the invention, can accurately judge whether the wafer is completely desorbed and whether there is sticking phenomenon on the wafer, for technician's follow-up to carry out follow-up processing to the wafer that sticks to the chip (for example, loading reverse voltage to electrostatic chuck ), which can effectively avoid damage to the wafer by the chip taking mechanism, improve the desorption yield of the wafer, and reduce the process cost.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer detachment method, a wafer detachment device and semiconductor processing equipment. Background technique [0002] In the integrated circuit chip manufacturing industry, the entire process of wafer processing generally includes processes such as photolithography, etching, ion implantation, metal deposition, and core packaging. In the plasma etching process, the etching machine accurately transfers the photoresist pattern such as lines, planes or holes produced by the photolithography process to the material under the photoresist to form the complex pattern that the entire integrated circuit should have. architecture. [0003] In the plasma etching process, generally, the wafer is placed on an electrostatic chuck in the reaction chamber of the semiconductor processing equipment, and the wafer is processed. The electrostatic chuck plays the role of sup...

AI Technical Summary

Problems solved by technology

However, the residual charge on the wafer after each process is not fixed, even after the same recipe is executed many times, it is not consistent, that is, the time required for each process to completely neutralize these residual charges is not fixed

However, the current time for applying reverse voltage is only an empirical value, which requires repeated experiments by craftsmen, and this empirical value cannot be applied to all situations.

[0008] Finally, the main basis for judging the adhesion of the wafer in the wafer desorption device is the flow rate of the refrigerant gas. It is not reliable to use this scheme to judge whether the wafer is stuck. It needs to ensure that the wafer is basically completely attached to the surface of the electrostatic chuck. If only the edge There is a little warping, and the refrigerant gas will overflow from the warping point, so that although the refrigerant gas flow rate is relatively large, it will still stick to the film, causing misjudgment

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