Drive circuit, matrix substrate, and display device

A technology for driving circuits and matrix substrates, which can be applied to circuits, identification devices, electrical components, etc., and can solve the problems of reduced mechanical strength and easy breakage of wiring.

Active Publication Date: 2019-10-11
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the mechanical strength of the lead-out wiring is lowered, and it is easy to break

Method used

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  • Drive circuit, matrix substrate, and display device
  • Drive circuit, matrix substrate, and display device
  • Drive circuit, matrix substrate, and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0037] Next, Embodiment 1 of the present invention will be described in detail.

[0038] (Constitution of Matrix Substrate)

[0039] figure 1 It is a plan view showing a schematic configuration of the matrix substrate 20 including the scanning line driving circuit 47 according to Embodiment 1 of the present invention.

[0040] Such as figure 1 As shown, the matrix substrate 20 includes an insulating substrate 21 , and the insulating substrate 21 has a display area 30 and a peripheral area 40 other than the display area 30 on its upper surface.

[0041] In the display area 30 , a plurality of scanning lines 31 (output lines) and a plurality of data lines 32 are arranged in a grid pattern. Also, while in figure 1 Not shown in , but other structures such as pixel transistors and pixel electrodes are also arranged in the display region 30 .

[0042] In the peripheral region 40 are arranged: a scanning line driving circuit 47 (driving circuit), which includes a plurality of...

Embodiment approach 2

[0168] based on Figure 15 ~ Figure 16 Another embodiment of the present invention will be described below. In addition, for convenience of description, members having the same functions as those described in the above-mentioned embodiments are given the same reference numerals, and descriptions thereof are omitted.

[0169] The matrix substrate 20 of the second embodiment differs from the matrix substrate 20 of the first embodiment in the following two points, but has the same configuration as the matrix substrate 20 of the first embodiment except for these points. First, in Embodiment 2, unlike Embodiment 1, additional wiring layer 27 and second interlayer insulating film 28 are laminated between insulating substrate 21 and gate layer 22 . Second, in Embodiment 2, unlike Embodiment 1, no transition portion 71 is provided, and the wiring or electrodes formed by the gate layer 22 and the wiring or electrodes formed by the source layer 25 are directly connected. .

[0170] ...

Embodiment approach 3

[0183] based on Figure 18 Another embodiment of the present invention will be described below. In addition, for convenience of description, members having the same functions as those described in the above-mentioned embodiments are given the same reference numerals, and descriptions thereof are omitted.

[0184] Figure 18 It is a plan view showing a schematic circuit configuration of a unit circuit 50 according to the third embodiment.

[0185] In the matrix substrate 20 of the third embodiment, compared with the matrix substrate 20 of the first embodiment, the arrangement of the first transistor Tr1 and the first relay wiring 66 is changed according to the change of the shape of the sixth transistor Tr6 . Except for this, the matrix substrate 20 of the third embodiment has the same configuration as the matrix substrate 20 of the first embodiment.

[0186] Such as Figure 18 As shown, the sixth transistor Tr6 in the third embodiment is divided by the first relay line 66 ...

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PUM

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Abstract

The purpose of the invention is to achieve a drive circuit having a high degree of freedom in arranging first-type wirings that connect unit circuits. Electrodes of respective transistors (Tr6.1, Tr6.2) connected in parallel and connection lines connecting the respective electrodes are formed respectively from a gate layer and a source layer. A first relay wiring (66) and a second relay wiring (67) are formed from an additional wiring layer, and are superposed on one (Tr6.1) of the transistors. An initialization wiring (68) is formed from the additional wiring layer, and is superposed on the connection lines.

Description

technical field [0001] The present invention relates to a driver circuit, and more particularly, to a matrix substrate on which the driver circuit is formed monolithically, and to a display device using the matrix substrate. Background technique [0002] In recent years, in order to reduce costs in small and medium-sized display devices, Gate Driver Monolithic (GDM) technology in which a scanning line driver circuit (Gate Driver) is monolithically formed on a matrix substrate has been adopted. For example, Patent Documents 1 to 3 disclose the use of (i) a display region in which pixel transistors are arranged, and (ii) a peripheral region in which scanning line driver circuits and source driver circuits for driving pixel transistors are arranged. Display device of source matrix substrate. [0003] Furthermore, high-definition is also being advanced in small and medium-sized display devices. Therefore, the longitudinal width (the width in the direction in which the data sig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09F9/30G02F1/133G02F1/1345H01L21/3205H01L21/768H01L23/522H01L29/786
CPCG02F1/13454G09G3/20G09G2300/0426G09G2310/0267G09G2310/0283G09G2310/0286G09F9/30H01L27/1225H01L27/1244H01L21/3205H01L21/768H01L23/522G02F1/1339G02F1/136286G02F1/1368
Inventor 吉田昌弘
Owner SHARP KK
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