Ultrasound probe and its connector structure

An ultrasonic probe and connector technology, applied in the field of medical devices, can solve the problems of increased manufacturing costs and R&D costs of circuit boards, high manufacturing costs of circuit boards, and increased thickness of circuit boards.

Active Publication Date: 2021-08-24
SONOSCAPE MEDICAL CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If there are many lines, it is necessary to increase the number of layers of the circuit board, so that the thickness of the circuit board is greatly increased, and the manufacturing cost of the circuit board with more than three layers is relatively high, so the increase in the thickness of the circuit board will greatly increase the manufacturing cost and R&D cost

Method used

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  • Ultrasound probe and its connector structure
  • Ultrasound probe and its connector structure
  • Ultrasound probe and its connector structure

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Embodiment Construction

[0039] The first object of the present invention is to provide a connector structure that can effectively solve the problem of high cost, and the second object of the present invention is to provide an ultrasonic probe including the connector structure.

[0040] Next, the technical solutions in the embodiments of the present invention will be apparent from the embodiment of the present invention, and it is clearly described, and it is understood that the described embodiments are merely embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, there are all other embodiments obtained without making creative labor without making creative labor premises.

[0041] In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the term "upper", "lower", "front", "post", left, and "right" or the like is based on the drawing. The orientation or positional relation...

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Abstract

The invention discloses an ultrasonic probe and its connector structure. The connector structure includes a first plug connector and a second plug connector adapted to the first plug connector; the first plug connector includes a plurality of circuit boards, and each circuit board Both are provided with first terminals; the second plug connector includes a circuit board, which is connected with the first terminals to form a signal transmission path. Since the first plug connector includes a plurality of circuit boards, more circuits can be respectively arranged on the plurality of circuit boards, which ensures that the thickness of a single circuit board will not be too thick. Compared with the prior art, the multiple thicknesses are thinner The circuit board with fewer layers has lower research and development costs and manufacturing costs than a single circuit board with a larger thickness and more layers in the prior art, thereby reducing the research and development costs and manufacturing costs of the connector structure.

Description

Technical field [0001] The present invention relates to the field of medical devices, and more particularly to an ultrasonic probe and a connector structure thereof. Background technique [0002] The ultrasonic probe includes a processor and a nutap (ultrasound transducer) disposed inside the housing, wherein the communication connection between the processor and the sound head is implemented by the connector structure. like Figure 1 As shown, the connector in the prior art is typically fixed to a plurality of connection terminals 03 on a circuit board 02, and the circuit board 02 is connected to the sound head 01. If the line is more, the number of layers of the circuit board is increased, and the thickness of the board is greatly increased, and the manufacturing cost of the three-layer circuit board is high, and the increase in the thickness of the circuit board will greatly increase manufacturing cost and R & D costs. [0003] In summary, how to effectively solve the problem o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R12/78H01R12/79H05K1/14
CPCH01R12/78H01R12/79H01R2201/12H05K1/148
Inventor 陈雄王艳辉
Owner SONOSCAPE MEDICAL CORP
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