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Anti-slip type high temperature sensor pressurized installation device

A technology for high-temperature sensors and installation devices, which is applied to the testing of measuring devices, instruments, machines/structural components, etc. It can solve the problems of extremely high reliability requirements for data measurement, large differences, and unrepeatable structural tests, etc., to achieve structural Effects that are simple, consistent, and flexible in design

Active Publication Date: 2021-03-23
BEIJING INST OF STRUCTURE & ENVIRONMENT ENG +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The ground thermal test of the aircraft is the main means to assess the structural response and failure mechanism of the aircraft structure in a thermal environment. Due to the particularity of the thermal test, the general structure cannot be repeatedly tested, so the reliability of the data measurement in the test is extremely high. However, the current high-temperature sensor pressurization installation methods are quite different, so there is an urgent need for a high-temperature sensor pressurization installation device to improve the reliability of thermal test data acquisition

Method used

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  • Anti-slip type high temperature sensor pressurized installation device
  • Anti-slip type high temperature sensor pressurized installation device
  • Anti-slip type high temperature sensor pressurized installation device

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Embodiment Construction

[0032] The implementation of the present invention will be described in detail below in conjunction with the accompanying drawings, but they do not constitute a limitation to the present invention, and are only examples. At the same time, the advantages of the present invention are clearer and easier to understand through the description.

[0033] Referring to the accompanying drawings, it can be seen that the present invention provides an anti-slip type high-temperature sensor pressurized installation device, including a support plate 7 for placing the sensor test piece 12, and a pressurization device for adjusting the sensor test piece 12 to be arranged on the support plate 7. Support 5; a plurality of pressurization assemblies 13 for pressurizing the pressurization points on the sensor test piece 12 are installed on the pressurization support 5, and the pressurization assembly 13 includes pressurization push rod 1 and pressurization top block 4; The pressure ejector rod 1 i...

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Abstract

The invention discloses an anti-skid type high temperature sensor pressurizing mounting device, and relates to a device for installing a high temperature sensor. The device comprises a support plate used for placing a sensor test piece and a pressurizing bracket used for adjusting the position of the sensor test piece on the support plate. A plurality of pressurizing assemblies for pressurizing the pressurizing point on the sensor test piece are mounted on the pressurizing bracket. Each pressurizing assembly comprises a pressurizing ejecting rod and a pressurizing ejecting block. The pressurizing ejecting rod is mounted on the pressurizing bracket. A pressurizing sheet covering the surface of the sensor test piece is connected on one end of the pressurizing ejecting block. The other end ofthe pressurizing ejecting block is connected with the pressurizing ejecting rod. An anti-loosening limiting mechanism used for preventing loosening between the pressurizing ejecting rod and the pressurizing ejecting bracket is also arranged between the pressurizing ejecting rod and the pressurizing ejecting bracket. The pressurization reliability in the sensor mounting process can be guaranteed and the device has the advantages of flexible design, simple structure, convenient operation and high sensor mounting reliability.

Description

technical field [0001] The invention relates to a device for installing a high temperature sensor, in particular to an anti-slip type high temperature sensor pressurized installation device. Background technique [0002] At present, most aircraft front-end structures are hemispherical and conical, and the materials used are mostly ceramic materials, fiber-reinforced resin-based composite materials and other materials with high temperature resistance and low thermal expansion coefficient. Ground thermal tests are usually used to assess the performance of such structures Thermal comprehensive performance, which analyzes structural performance by collecting data using high-temperature sensors during testing. Due to the special shape and material of the front end structure of the aircraft, there are many problems in the pressurized installation of the high-temperature sensor in the ground thermal test. The surface-mounted high-temperature sensor of ceramic material or composite ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01M99/00G01M13/00
CPCG01M13/00G01M99/002
Inventor 陈鑫何西波胡由宏谢新扬刘永清田玉坤郑毅何振威邱恒斌甄雷兴曹志伟罗俊清肖乃风胡绍华
Owner BEIJING INST OF STRUCTURE & ENVIRONMENT ENG
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