A kind of anti-scratch semiconductor ingot point opening processing equipment

Abstract

The invention discloses an anti-scratch semiconductor crystal ingot point opening processing device, the structure of which comprises a control box, a partition board, a pocket rod grid, an operation head, a concave-convex card box, a bottom pocket box, a control box and a partition The boards are connected, the pocket rods are embedded in the compartment board, the operation head is connected with the bottom pocket box, the cut end will fall into the inner space, and the sharp end will be stuck in the empty slot, and the bottom The inner expansion strip at the end will hold the force it stretches, and control its stretching range so that it will not stretch too much. When it continues to sink, it will be squeezed from the outside to make the inner part of the mouth full The gas is activated, so that the object can be placed in the inner space according to its own size. After cutting off a sharp ingot, it can be naturally dropped to the corresponding position, and it can be placed in a concave-convex manner according to its own shape. Handle it to prevent it from rolling again, or the sharp end accidentally injuring the equipment.

Description

Technical field [0001] The present invention belongs to the semiconductor field, more specifically, and more particularly to an anti-scratch-resistant semiconductor waffle tip opening section processing apparatus. Background technique [0002] During production, the semiconductor waffle needs to be pulled by multiple pull, pulling it into a diameter of the same thickness, and the pulling is pulled by pulling, and the diameter size and mid-section different cone will be formed while the waist is formed. Head, it is necessary to cut it in subsequent processing, and the semiconductor waft is required to be fixed. [0003] Based on the above-described invention, the existing semiconductor waffle treatment equipment mainly presents the following shortcomings, such as: [0004] When cutting excess cone, since the waft is formed, the material is hard, and its more sharp cone is dropped into the device, and the sharp end is easy to damage the equipment, even due to its excessive. It is u...

AI Technical Summary

Problems solved by technology

[0004] When cutting the extra conical head, because the material of the ingot is hard after it is formed, its sharper conical head will fall into the equipment storage compartment, and the sharp end will easily damage the equipment, and even roll due to its overweight. Out of scope, causing unnecessary harm to staff

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