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Package structure and package method

A tube-shell packaging and packaging method technology, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of insulating rings and flanges overflowing, and achieve the effect of improving packaging quality

Active Publication Date: 2021-04-20
KUNSHAN HUATAI ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of this, the object of the present invention is to provide a shell packaging structure and packaging method to solve the phenomenon of glue overflow between the insulating ring and the flange during the packaging process.

Method used

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  • Package structure and package method
  • Package structure and package method

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Embodiment Construction

[0039] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0040] The invention discloses a tube shell package structure, which includes an insulating ring and a metal flange packaged in the insulating ring. The insulating ring includes a first surface and a second surface oppositely arranged. A hollow inner cavity is arranged in the insulating ring. The flange is fixed in the inner cavity of t...

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Abstract

The invention discloses a shell packaging structure and a packaging method. The shell packaging structure includes an insulating ring and a metal flange packaged in the insulating ring. The insulating ring includes a first surface and a second surface oppositely arranged. The insulating ring is provided with a hollow inner cavity, the metal flange is fixed in the inner cavity of the insulating ring, the first surface and the second surface of the insulating ring are respectively packaged with metal fins and metal sheets, and the metal flange Several glue guide grooves are provided between the outer wall and the inner wall of the insulating ring and / or on the first surface and the second surface of the insulating ring. In the present invention, the metal flange and the insulating ring are bonded and fixed, and a glue guide groove is set between the outer wall of the metal flange and the inner wall of the insulating ring, which can control the glue overflow during the bonding process, and prevent the glue from overflowing to the patch area and affecting the chip patch , greatly improving the packaging quality.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a tube and shell packaging structure and a packaging method. Background technique [0002] The power semiconductor device packaging case has a great influence on the electrical and thermodynamic performance of the entire transistor. The package case provides an electrical path and a heat dissipation path for the die to connect to the external circuit, and is an important supporting part to ensure the normal operation of the semiconductor device. With the continuous development of modern communication systems, higher requirements are placed on the performance indicators of power amplifier circuits used in communication circuits. In order to meet the application requirements of high operating bandwidth, it is necessary to optimize the design of the radio frequency circuit structure and matching circuit. [0003] In the prior art, the semiconductor package shell us...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/10H01L23/16H01L21/54H01L21/50
CPCH01L21/50H01L21/54H01L23/10H01L23/16
Inventor 李朋
Owner KUNSHAN HUATAI ELECTRONICS TECH CO LTD