Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Tube package structure and package method

A tube-shell packaging and packaging method technology, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of insulating rings and flanges overflowing, and achieve the effect of improving packaging quality

Active Publication Date: 2019-11-05
KUNSHAN HUATAI ELECTRONICS TECH CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of this, the object of the present invention is to provide a shell packaging structure and packaging method to solve the phenomenon of glue overflow between the insulating ring and the flange during the packaging process.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Tube package structure and package method
  • Tube package structure and package method
  • Tube package structure and package method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0040] The invention discloses a tube shell package structure, which includes an insulating ring and a metal flange packaged in the insulating ring. The insulating ring includes a first surface and a second surface oppositely arranged. A hollow inner cavity is arranged in the insulating ring. The flange is fixed in the inner cavity of t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a tube package structure and a package method. The tube package structure comprises an insulating ring and a metal flange packaged in the insulating ring. The insulating ring comprises a first surface and a second surface, wherein the first surface and a second surface are opposite to each other. A hollow inner cavity is arranged in the insulating ring. The metal flange isfixed in the inner cavity of the insulating ring. Metal fins and metal sheets are packaged on the first surface and the second surface of the insulating ring respectively. A number of glue guiding grooves are arranged between the outer wall of the metal flange and the inner wall of the insulating ring and / or the first surface and the second surface of the insulating ring. According to the invention, the metal flange is fixedly bonded to the insulating ring; the glue guiding grooves are arranged between the outer wall of the metal flange and the inner wall of the insulating ring; excessive gluein the bonding process can be controlled; glue is prevented from spilling to a patch area to affect a chip patch; and the package quality is greatly improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a tube and shell packaging structure and a packaging method. Background technique [0002] The power semiconductor device packaging case has a great influence on the electrical and thermodynamic performance of the entire transistor. The package case provides an electrical path and a heat dissipation path for the die to connect to the external circuit, and is an important supporting part to ensure the normal operation of the semiconductor device. With the continuous development of modern communication systems, higher requirements are placed on the performance indicators of power amplifier circuits used in communication circuits. In order to meet the application requirements of high operating bandwidth, it is necessary to optimize the design of the radio frequency circuit structure and matching circuit. [0003] In the prior art, the semiconductor package shell us...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/10H01L23/16H01L21/54H01L21/50
CPCH01L21/50H01L21/54H01L23/10H01L23/16
Inventor 李朋
Owner KUNSHAN HUATAI ELECTRONICS TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com