Method for manufacturing laminated strip-shaped LED backlight modules

Abstract

The invention provides a method for manufacturing laminated strip-shaped LED backlight modules. The method comprises the following steps: providing a dust-free chamber serving as a working space; providing a strip-shaped graphite substrate; coating one top surface of the graphite substrate with an insulating adhesive film layer; attaching and fixing at least one group of electrode wires to the surface of the insulating adhesive film layer; arranging a plurality of LED chips along the electrode wires, utilizing a method of routing and fixing crystals to electrically connect two poles of each LED chip with the electrode wires and coating the surfaces of the LED chips with fluorescent agent; utilizing a vacuum laminating method to form an encapsulation layer outside the LED chips; and installing and fixing a strip-shaped lens on the surface of the encapsulation layer. The method has the advantages of enabling heat produced by the operation of the LED chips to be effectively led out and dissipated, promoting the encapsulation quality of LED, providing backlight used by large-size panels through a small amount of installation and reducing cost through sufficient luminance and brightnessuniformity.

Description

technical field [0001] The invention relates to a manufacturing method of a laminated strip LED backlight module. Background technique [0002] Backlight module (Backlight module) generally refers to a component used to provide a back light source for a product. It is currently widely used in information, communication, and consumer products, such as liquid crystal displays, scanners, and light boxes. The structure of the backlight module is mainly divided into two types: side-light type and direct-light type according to the incident position of the light source. The side-light type structure is to install cold cathode tubes or strip-shaped LED (light-emitting diode) light sources on the light guide plate. The light-incident side, which is usually applied to panels that need to be thinned or smaller in size; and the direct-down structure is to arrange multiple cold-cathode tubes or strip-shaped LED (light-emitting diode) light sources on the guide at intervals. At the back...

AI Technical Summary

Problems solved by technology

[0004] Most of the existing direct-lit backlight modules that use LEDs as light source components use aluminum substrates as LED brackets. However, due to the limited heat dissipation efficiency of aluminum substrate materials, in order to obtain better heat dissipation effects, they usually occupy a considerable volume. It is beneficial to the space design of the product, and there is a cost problem that the quantity of use cannot be reduced; moreover, due to the lack of a proper and complete process design, the packaging quality of the LED is also difficult to control (prone to light decay).

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