Chip packaging drying device with temperature balancing function

Abstract

The invention relates to the technical field of chip manufacturing, and discloses a chip packaging drying device with a temperature balancing function, the chip packaging drying device comprises an inner box body, the inner side wall of the inner box body is fixedly connected with a drying pipeline, the bottom of the drying pipeline is fixedly connected with a drying nozzle, and the outer side wall of the drying pipeline is fixedly connected with a thermal expansion piece. The top end of the thermal expansion piece is fixedly connected with a heat absorption fin, and the inner side wall of thethermal expansion piece is slidably connected with a push plate. Due to the fact that the inner diameter of the drying pipeline is affected by the position of the adjusting plate and the position ofthe adjusting plate is affected by the heat absorption fins on the thermal expansion piece, when the temperature is high, the adjusting plate automatically adjusts the inner diameter of the drying pipeline, the inner diameter of the drying pipeline is reduced, and then drying gas introduced into the drying pipeline is reduced accordingly; therefore, the purpose of controlling the temperature between the interlayers is achieved, the temperature between the interlayers is kept consistent, the packaging quality of the chip is effectively improved, and the packaging yield of the chip is improved.

Description

technical field [0001] The invention relates to the technical field of chip manufacturing, in particular to a drying device for chip packaging with a temperature balancing function. Background technique [0002] The shell used to install the semiconductor integrated circuit chip plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, and it is also a bridge to communicate the internal world of the chip with the external circuit - the contacts on the chip are connected to the packaging shell with wires On the pins, these pins are connected to other devices through the wires on the printed board. Therefore, packaging plays an important role for CPUs and other LSI integrated circuits. In the process of chip packaging, glue needs to be dispensed, and after the glue is dispensed, it needs to be dried. [0003] In the prior art, during the drying process, due to the relative sealing of each layer in the box, the temperature be...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a drying device for chip packaging with the function of balancing temperature, which is equipped with layered drying, self-adjustment of drying ventilation according to temperature and simultaneous clamping of drying racks to avoid The advantage of swaying solves the problem that during the drying process, due to the relative sealing of each layer in the box, the temperature between different layers is inconsistent, which affects the drying effect of the chip and reduces the yield rate of the chip package. At the same time, During the drying process, the drying rack is affected by the drying air flow, which is prone to shaking, which further affects the packaging quality and reduces the yield rate of packaging.

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