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Waterproof treatment process for hardware product

A technology for waterproof treatment and products, applied in electrical components, electrical equipment casings/cabinets/drawers, special surfaces, etc., can solve the problem of less design space for electronic waterproofing, and achieve the effect of high-efficiency waterproofing, reducing the number of parts, and low cost

Inactive Publication Date: 2018-10-26
深圳天科新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, with the development of mobile phones from the previous "big brother" to thin and light, and the development of wearables from the previous mechanical type to the current smart type, there is less and less design space for traditional structural waterproofing and electronic waterproofing. How to effectively realize the above has also become a difficult problem in the industry

Method used

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  • Waterproof treatment process for hardware product

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Embodiment Construction

[0029] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0030] A waterproof treatment process for hardware products, comprising the following steps: step A, selecting corresponding waterproof coating materials according to different substrates and functions of products; step B, subpackaging corresponding waterproof coating materials into syringes of different dispensing machines Inside; step C, set the dispensing route and glue output of different dispensing machines according to needs; step D, dispensing through the dispensing machine corresponding to the position of different substrates and functions of the product, and quickly place it for automatic leveling. The treatment process of the present invention selects different waterproof coating materials according to the ...

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Abstract

The invention relates to a waterproof treatment process for a hardware product. The waterproof treatment process for the hardware product comprises the following steps that A, corresponding waterproofcoating materials are selected according to different base materials and functions of the product; B, the corresponding waterproof coating materials are placed into needle cylinders of different dispensers; C, dispensing paths and glue discharging quantities of the different dispensers are set according to requirements; and D, glue dispensing is conducted on corresponding positions, made from thedifferent base materials and having the different functions, of the product through the dispensers, and the product is rapidly placed to allow glue to automatically flow flat. By adoption of the technical scheme, the requirement for light and thin design of existing products can be met, the number of elastomers used by traditional structures for water prevention is effectively reduced, the numberof parts of the product is reduced, the production efficiency is improved, and meanwhile, the requirement for efficient water prevention of the hardware product is effectively met.

Description

technical field [0001] The invention relates to the technical field of product waterproofing, in particular to a hardware product waterproofing process. Background technique [0002] As smartphones become more and more an inseparable part of people's lives, mobile phones represented by Apple iPhone7 put forward the concept of IPX7 (level 7 waterproof) earlier, gradually making waterproof requirements a standard for mid-to-high-end mobile phones match. At the same time, with the rise of the fourth industrial revolution represented by IOT (Internet of things), terminal products represented by smart hardware, such as wearable hardware, are becoming effective supplements to mobile phones, and the requirement for waterproofing has become a It is an inevitable requirement to do this kind of product. [0003] The focus of waterproofing lies in the gaps between the structural parts, the socket position of the electronic parts and the chips and electronic devices on the circuit boa...

Claims

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Application Information

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IPC IPC(8): B05D5/00B05D7/24H05K5/06
CPCB05D5/00B05D7/24B05D2506/10H05K5/06H05K5/062
Inventor 张银好
Owner 深圳天科新材料有限公司
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