Thermoelectric conversion element layer and method for producing same
A technology of thermoelectric conversion and thermoelectric elements, which is applied in the manufacture/processing of thermoelectric devices, electrical components, parts and components of thermoelectric devices, etc. It can solve the problems of reduced thermoelectric performance of thermoelectric element layers, increased resistance of metal electrodes, and inability to withstand long-term use. , to achieve the effect of excellent durability
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Embodiment 1
[0208]
[0209] Polyolefin resin (thickness 25μm, WVTR6.0g·m -2 ·day -1 ) was directly pasted on the surface of the thermoelectric element layer prepared on one side of the polyimide film substrate as a sealing layer, and the thermoelectric conversion element layer was produced.
[0210] In the method of forming the sealant layer, first, a polyolefin-based resin is formed on a release film by a known coating method. Then, the thermoelectric element layer was pasted on the surface of the thermoelectric element layer using a laminator, and then the release film was peeled off to form a sealing layer.
[0211] For the polyolefin resin, a polyisoprene-based rubber (manufactured by Kuraray Co., Ltd., LIR410, number average molecular weight: 30,000, number of carboxylic acid functional groups per molecule: 10) containing a carboxylic acid functional group was used. 5 parts by mass, rubber polymers without carboxylic acid functional groups: 100 parts by mass of a copolymer of iso...
Embodiment 2
[0213] The sealing layer used in Example 1 was further pasted on the other surface of the polyimide film substrate having no thermoelectric element layer, and a thermoelectric conversion element layer was produced in the same manner as in Example 1.
Embodiment 3
[0215] The sealing layer that is arranged on the both sides of polyimide film substrate of embodiment 2 is changed into two layers and is epoxy resin (thickness 24 μm, WVTR160g·m -2 ·day -1 ), and the thermoelectric conversion element layer was fabricated in the same manner as in Example 2, except that the sealing layer was cured at 100° C. for 2 hours after the sealing layer was pasted.
[0216]100 parts by mass of acid-modified polyolefin resin (α-olefin polymer, manufactured by Mitsui Chemicals, Inc., trade name: Unistole H-200, number average molecular weight: 47,000), polyfunctional epoxy compound (1) (hydrogenated bis Phenol A diglycidyl ether, manufactured by Kyoeisha Chemical Co., Ltd., trade name: Epolight 4000, epoxy equivalent 215 to 245 g / eq, molecular weight: 800) 100 parts by mass, thickener (styrene-based monomer aliphatic) Monomer copolymer, softening point 95° C., manufactured by Mitsui Chemicals, Inc., trade name: FTR6100) 50 parts by mass, imidazole-based c...
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