Apparatus and method for processing substrate
A technology for substrates and processing liquids, which is applied in the directions of cleaning methods using liquids, chemical instruments and methods, cleaning methods and utensils, etc., and can solve problems such as device damage, removal of liquid splashes, and damage to the substrate Wa and the support plate Wb.
Active Publication Date: 2019-12-03
SEMES CO LTD
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- Application Information
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Problems solved by technology
[0006] Therefore, the time taken to perform the removal process increases, and the substrate Wa and the support plate Wb may be damaged in the process in which the substrate Wa and the support plate Wb are separated from each other.
[0007] Additionally, during the process of dispensing the removal solution, some of the removal solution can be splashed causing damage to the substrate and devices around the substrate
Method used
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[0031] Various modifications and changes can be made to the embodiments of the inventive concept, and the scope of the inventive concept should not be construed as being limited to the embodiments set forth herein. These embodiments are provided to make this disclosure thorough and complete, and to fully convey the scope of the inventive concept to those skilled in the art. Therefore, in the drawings, the shapes of the components are exaggerated for clear description.
[0032] In this embodiment, a process of cleaning or etching an object will be exemplified. Here, the object is defined as an object having a substrate and a support plate bonded together by an adhesive. In the following, we will refer to Figure 2 to Figure 7 The embodiments of the inventive concept are described in detail.
[0033] figure 2 It is a plan view showing the substrate processing apparatus 1 according to an embodiment of the inventive concept. reference figure 2 , The substrate processing equipment...
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Embodiments of the inventive concept described herein relate to an apparatus and method for removing an adhesive exposed to the outside from an object being processed. The apparatus for removing the adhesive exposed to the outside from an edge region of the object being processed, in which the object has a patterned substrate and a support plate bonded together by the adhesive. The cover liquid nozzle dispenses the cover liquid onto a cover area of a top surface of the object other than the exposed area, and the controller controls the cover liquid dispensing member to adjust a flow rate of the cover liquid to cause a removal rate of the adhesive to remain constant.
Description
Technical field [0001] The embodiments of the inventive concept described herein relate to an apparatus and method for removing adhesive exposed to the outside from an object to be processed, wherein the object has a substrate and a support plate bonded together by an adhesive. Background technique [0002] Various processes (such as photolithography, ashing, etching, ion implantation, thin film deposition, cleaning, etc.) are performed on the substrate to manufacture semiconductor devices. [0003] Generally, through silicon via (TSV) substrates are very thin and easily damaged by small impacts. Thus, as figure 1 As shown, the substrate Wa undergoes various processes in a state of being adhered to the support plate Wb. During the process, various film layers or patterns are formed on the substrate Wa, and the substrate Wa has a predetermined thickness. After the pattern is formed on the substrate Wa and before the process of separating the substrate Wa and the support plate Wb, ...
Claims
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IPC IPC(8): H01L21/67
CPCH01L21/67023H01L21/6715H01L21/6836H01L2221/68381B32B43/006B32B41/00H01L21/67132B32B2457/14H01L21/67051Y10S134/902B08B3/024H01L21/6708B08B3/08
Inventor 田明娥李茂贤李瑟
Owner SEMES CO LTD