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A server and its hard disk quick disassembly heat dissipation composite module

A composite mold and hard disk technology, applied in the server field, can solve the problems of M.2 hard disk cooling efficiency not guaranteed, fast read and write speed, cold air is difficult to reach, etc.

Active Publication Date: 2021-06-11
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the M.2 hard disk can be hot-swapped, when disassembling and maintaining the M.2 hard disk, the server chassis must be disassembled before the operation can be conveniently performed. The efficiency of disassembling and maintaining the hard disk is not high and the operation process cumbersome
At the same time, due to the high storage density and fast read and write speed of the M.2 hard disk, it is easy to generate a large amount of heat during operation, and has high requirements for the heat dissipation environment. However, inside the chassis, due to the complex components and narrow installation environment, The cold air blown by the chassis fan is difficult to reach the M.2 hard disk, resulting in the unguaranteed heat dissipation efficiency of the M.2 hard disk

Method used

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  • A server and its hard disk quick disassembly heat dissipation composite module
  • A server and its hard disk quick disassembly heat dissipation composite module
  • A server and its hard disk quick disassembly heat dissipation composite module

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Embodiment Construction

[0037]Next, the technical solutions in the embodiments of the present invention will be apparent from the embodiment of the present invention, and it is clearly described, and it is understood that the described embodiments are merely embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, there are all other embodiments obtained without making creative labor without making creative labor premises.

[0038] Please refer to figure 1 , figure 1 A schematic structural diagram of a hard disk quickly disassemble the heat dissipation composite module and the chassis 1 in accordance with a specific embodiment of the present invention.

[0039] In a particular embodiment of the invention, the hard disk is quickly disassemble the heat dissipation composite module, mainly including mounting bracket 3, storage hard disk 4, and heat sink.

[0040] Among them, the mounting bracket 3 is the main structure of the hard disk quickly disa...

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Abstract

The invention discloses a composite module for fast disassembly and assembly of hard disks, which includes a mounting bracket, a storage hard disk detachably arranged on the mounting bracket, and a storage hard disk detachably arranged on the The heat dissipation mechanism for dissipating the heat generated during operation, the mounting bracket is slidably arranged in the hard disk slot reserved on the chassis, so that when sliding into place, the storage hard disk is connected to the preset in the chassis to form a plug fit. The invention realizes the disassembly and assembly operation of the hard disk through the sliding of the installation bracket in the hard disk slot, and does not need to open and disassemble the chassis. On the basis of realizing the hot-swapping operation of the hard disk, the efficiency of disassembly and maintenance of the hard disk is improved. It realizes operation and maintenance without opening the box, and at the same time, the heat dissipation efficiency of the hard disk is improved through the cooperation of the heat dissipation mechanism and the chassis fan. The invention also discloses a server, and its beneficial effect is as above.

Description

Technical field [0001] The present invention relates to the field of servers, and in particular, to a hard disk rapid disassembly heat dissipation composite module. The invention also relates to a server. Background technique [0002] With the development of China's electronic technology, more and more electronic devices have been widely used. [0003] The server is an important part of the electronic device and is a device that provides calculation services. Since the server needs to respond to service requests and processes, the server should have the ability to assume services and secure services. Different from the service type provided by the server, divided into file server, database server, application server, web server, etc. The main components of the server include processors, hard drives, memory, system bus, etc., and general computer architectures, but because high reliable services are required, therefore in processing capacity, stability, reliability, security, scal...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/18G06F1/20G11B33/14
CPCG06F1/187G06F1/20G11B33/1426
Inventor 杨晓东
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD
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