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Leaching and solidifying combined remediation method for soil polluted with circuit board etching liquid

A technology of polluted soil and joint restoration, applied in the restoration of polluted soil and other directions, can solve the problems of high cost, poor curing effect of curing method, and secondary pollution.

Inactive Publication Date: 2020-02-11
SUZHOU ZHONGSHENG ENVIRONMENTAL REMEDIATION CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the curing method can only be applied to the remediation of moderately and lightly polluted soil. For heavily polluted soil, the curing method has poor curing effect, high cost and will cause secondary pollution.

Method used

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  • Leaching and solidifying combined remediation method for soil polluted with circuit board etching liquid

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0021] Dry the polluted soil and crush it after drying. After crushing, the particle size is within 50mm. Use the eluent to wash the contaminated soil. The eluent and the contaminated soil are mixed and stirred for 4 hours, and then the eluent is drawn out to form an eluent. The eluent and the eluate can be reused as the eluent after being regenerated with the supplement agent. The eluent is citric acid-EDDS solution, the content of citric acid is 1%, and the content of EDDS is 0.1%. The ratio of the contaminated soil to the contaminated soil is 2:1, and the copper-nickel content in the soil is tested by sampling. The number of leaching is determined according to the copper-nickel content, and the soil is solidified. The solidifying agent is a Portland silicate and attapulgite mixed solidifying agent. The amount of blue silicate is 5% of the soil volume, and the attapulgite can be added after being modified and pretreated with HCl with a concentration of 1mol / L, and the additio...

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Abstract

The invention relates to the technical field of soil maintenance, and especially relates to a leaching and solidifying combined remediation method for soil polluted with a circuit board etching liquid. The method has the advantages of low cost, convenience in operation, and good remediation effect. The method comprises the following steps: (1) the polluted soil is dried, and then is crushed; (2) the polluted soil is leached with a leaching solution, the leaching solution and the polluted soil are mixed and stirred, and then stay for 4 h, and the leaching solution is extracted to form an eluate; and (3) the soil is solidified.

Description

technical field [0001] The invention relates to the technical field of soil maintenance, in particular to a combined leaching and solidification repair method for soil contaminated by etching liquid of circuit boards. Background technique [0002] As we all know, with the continuous acceleration of industrialization and urbanization in our country, the problem of soil environmental pollution is becoming more and more serious, polluting about 10% of farmland soil, and hundreds of thousands of hectares of polluted sites left over from the relocation of enterprises, which poses a serious threat to the sustainable use of land resources and the ecological safety of agricultural products. The threat to the pollution site is imminent. [0003] The waste acid etching solution is a blue-green strong acidic liquid, mainly containing cupric chloride, cuprous chloride, hydrogen peroxide and hydrochloric acid, and the copper content can reach 150-250g / L. These substances enter the soil a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B09C1/08
CPCB09C1/08
Inventor 戴思远艾金华秦惠平潘澄
Owner SUZHOU ZHONGSHENG ENVIRONMENTAL REMEDIATION CO LTD