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Apparatus for measuring sample thickness and method for measuring sample thickness

A technology for measuring thickness and equipment, which is applied to equipment for measuring thickness and the field of measuring thickness, which can solve problems such as difficulty in accurate measurement, environmental safety problems, and damage to the object to be measured.

Pending Publication Date: 2020-02-21
SAMSUNG DISPLAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the conventional method for measuring thickness causes problems such as damage to the object to be measured and environmental safety problems due to radioactivity, and it is difficult to accurately measure the thickness of an object to be measured having a relatively large thickness

Method used

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  • Apparatus for measuring sample thickness and method for measuring sample thickness
  • Apparatus for measuring sample thickness and method for measuring sample thickness
  • Apparatus for measuring sample thickness and method for measuring sample thickness

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Embodiment Construction

[0036] Embodiments will now be described more fully hereinafter with reference to the accompanying drawings. Although the inventive concept may be modified in various ways and has several embodiments, the embodiments are shown in the drawings and will mainly be described in the specification. However, the scope of the inventive concept is not limited to the embodiments, and should be construed to include all changes, equivalents, and replacements included in the spirit and scope of the inventive concept.

[0037] In the drawings, the thicknesses of various layers and regions are shown in an exaggerated manner for clarity and ease of description thereof. When a layer, region or panel is referred to as being "on" another layer, region or panel, the layer, region or panel may be directly on the other layer, region or panel, or there may be Intermediate layers, regions, or boards. In contrast, when a layer, region or panel is referred to as being "directly on" another layer, reg...

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PUM

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Abstract

The invention provides an apparatus for measuring sample thickness and a method for measuring sample thickness. The apparatus for measuring thickness includes: a chamber; a sound wave transmitter transmitting a sound wave in the chamber; a sound wave receiver receiving the sound wave transmitted from the sound wave transmitter in the chamber; and a supporter between the sound wave transmitter andthe sound wave receiver.

Description

[0001] This application claims priority from Korean Patent Application No. 10-2018-0094214 filed on Aug. 13, 2018 at the Korean Intellectual Property Office (KIPO), the disclosure of which is hereby incorporated by reference in its entirety. technical field [0002] Embodiments of the inventive concept relate to an apparatus for measuring thickness and a method for measuring thickness. Background technique [0003] Examples of methods for measuring thickness may include direct measurement methods, optical methods, X-ray methods, and ultrasonic methods. However, the conventional method for measuring thickness causes problems such as damage to an object to be measured and environmental safety problems due to radiation, and it is difficult to accurately measure the thickness of an object to be measured having a relatively large thickness. [0004] It will be appreciated that this Background of the Technology section is intended to provide a useful background for understanding t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B17/02
CPCG01B17/02G01B15/02G01D21/02G01K1/02F25D19/00G01N2291/101G01N29/07G01N29/326G01N29/32G01N2291/02854G01N2291/048G01N2291/102G01N2291/0234G01B17/025
Inventor 千圣贤
Owner SAMSUNG DISPLAY CO LTD